Thermo-mechanical design of a generic 0-level MEMS package using chip capping and through silicon via's

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010

Volumn , Issue , 2010, Pages

  Vandevelde, B ^a   Jansen, R ^a   Bouwstra, S ^b   Pham, N ^a   Majeed, B ^a   Limaye, P ^a   Beyne, E ^a   Tilmans, H A C ^a  

^a IMEC   (Belgium)

^b MEMS TC   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL CONNECTION; INTERMETALLIC COMPOUNDS; LTCC SUBSTRATES; MECHANICAL STRESS; MEMS PACKAGES; PACKAGE RELIABILITY; POLYMER DIELECTRICS; SECOND LEVEL; TEMPERATURE CYCLING; THERMO-MECHANICAL DESIGN; THERMOMECHANICAL SIMULATION; THROUGH-SILICON-VIA;

CHIP SCALE PACKAGES; DESIGN; DIES; ELECTRIC CONNECTORS; FLIP CHIP DEVICES; INTERMETALLICS; MICROELECTRONICS; MICROSYSTEMS; PACKAGING; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; SILICON COMPOUNDS; SOLDERING ALLOYS; THERMOMECHANICAL TREATMENT;

STRESSES;

EID: 77953710772     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESIME.2010.5464539     Document Type: Conference Paper

References (7)

1. A. M. Leung, J. Jones, E. Czyzewska, J. Chen and B. Woods, "Micromachined accelerometer based on convection heat transfer", Proc. MEMS'98, Heidelberg, Germany, pp. 627-630, 1998.
2. D. R. Sparks, L. Jordan and J. H. Frazee, "Flexible vacuum-packaging method for resonating micromachines", Sensors and Actuators A, 55, pp. 179-183, 1996.
3. P. K. Khanna, S. K. Bhatnagar and W. Gust, "Analysis of packaging and sealing techniques for microelectronic modules and recent advances", Microelectronics International, 16, no. 2, pp. 8-12, 1999.
4. H. A. C. Tilmans E. Fullin, H. Ziad, M. Van de Peer, J. Kesters, E. Van Geffen, J. Bergqvist, M. Pantus, E. Beyne, K. Baert, F. Naso, "A fully-packaged electromagnetic microrelay," Proc. MEMS '99, Orlando, Fl. USA, 17-21 Jan., 1999, pp. 25-30, 1999.
5. Rahul Agarwal, Wenqi Zhang, Paresh Limaye, Wouter Ruythooren, High Density Cu-Sn TLP Bonding for 3D Integration, Proc 59th Electronic Components and Technology Conference, pp 345-349, 26-29 May, 2009.
6. B. Majeed, M. Van Cauwenberghe, D. Sabuncuoglu Tezcan and P. Soussan, Failure analysis and process improvement for through silicon via interconnects, MRS spring conference, Symposium, 2009.
7. th Electronic Components and Technology Conference, pp 1751-1754, May 2008.