Preparation, characterization and curing properties of epoxy-terminated poly(alkyl-phenylene oxide)s

European Polymer Journal

Volumn 46, Issue 7, 2010, Pages 1488-1497

  Su, Chia Teh ^a   Lin, Kun Yu ^a   Lee, Tzung Jan ^a   Liang, Mong ^a  

^a NATIONAL CHIAYI UNIVERSITY   (Taiwan)

Author keywords

Curing; Epoxy; Poly(alkyl phenylene ether); Poly(alkyl phenylene oxide); Structure property correlation

Indexed keywords

ALKYLPHENOLS; AMINE CATALYSTS; AROMATIC DIOLS; BIPHENOL; CHAR YIELD; CHEMICAL STRUCTURE; CURED EPOXY RESINS; CURING AGENTS; CURING PROPERTIES; DICYANDIAMIDE; DIELECTRIC CONSTANTS; DIGLYCIDYL ETHER OF BISPHENOL-A; EPICHLOROHYDRIN; EPOXY; EPOXY BLENDS; EPOXY SYSTEMS; GLASS TRANSITION TEMPERATURE; HIGHER T; MATRIX; METHYLIMIDAZOLE; OXIDATIVE POLYMERIZATION; POLY(ALKYL-PHENYLENE OXIDE); RIGID ROD STRUCTURE; STRUCTURE-PROPERTY CORRELATION; TELECHELICS; THERMAL PROPERTIES; THERMAL STABILITY;

ALKYLATION; CHROMATOGRAPHIC ANALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ETHERS; FLAME RESISTANCE; GELS; GLASS TRANSITION; MANGANESE; MANGANESE OXIDE; NUCLEAR MAGNETIC RESONANCE; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PHENOLS; POLYMER BLENDS; POLYMERS; RESINS; RESONANCE; RIGID STRUCTURES; STRUCTURAL PROPERTIES; THERMODYNAMIC PROPERTIES; THERMOGRAVIMETRIC ANALYSIS;

EPOXY RESINS;

EID: 77953621237     PISSN: 00143057     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.eurpolymj.2010.04.016     Document Type: Article

References (26)

1. Maier G. Low dielectric constant polymers for microelectronics. Prog Polym Sci 26 (2001) 3-65
2. Venderbosch R.W., Meijer H.E.H., and Lemstra P.J. Processing of intractable polymers using reactive solvents: 3. Mechanical properties of poly(2,6-dimethyl-1,4-phenylene ether) processed by using various epoxy resin systems. Polymer 36 (1995) 2903-2913
3. Meng J., Liang G., and Zhao L. Study on epoxy matrix modified with poly(2,6-dimethyl-1,4-phenylene ether) for application to copper clad laminate. Compos Sci Technol 62 (2002) 783-789
4. Hwang H.J., Hsu S.W., Chung C.J., and Wang C.S. Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy. React Funct Polym 68 (2008) 1185-1193
5. Nunoshige J., Akahoshi H., Shibasaki Y., and Ueda M. Efficient oxidative coupling polymerization for synthesis of thermosetting poly(phenylene ether) copolymer with a low dielectric loss. J Polym Sci Part A: Polym Chem 46 (2008) 5278-5282
6. Fukuhara T., Shibasaki Y., Ando S., and Ueda M. Synthesis of thermosetting poly(phenylene ether) containing allyl groups. Polymer 45 (2004) 843-847
7. Matsumoto K., Shibasaki Y., Ando S., and Ueda M. Synthesis of photosensitive and thermosetting poly(phenylene ether) based on poly[2,6-di(3-methyl-2-butenyl)phenol-co-2,6-dimethyl-phenol] and a photoacid generator. J Polym Sci Part A: Polym Chem 43 (2005) 149-156
8. Chao H.I.S., and Whalen J.M. Preparation of poly(2,6-dimethyl-1,4-phenylene ether) (PPE)/epoxy laminate with functionalized PPE resin. J Appl Polym Sci 49 (1993) 1537-1546
9. Huang C.C., Yang M.S., and Liang M. Synthesis of new thermosetting poly(2,6-dimethyl-1,4-phenylene oxide)s containing epoxide pendant groups. J Polym Sci Part A: Polym Chem 44 (2006) 5875-5886
10. Bhole Y.S., Karadkar P.B., and Kharul U.K. Nitration and amination of polyphenylene oxide: synthesis, gas sorption and permeation analysis. Eur Polym J 43 (2007) 1450-1459
11. Bhole Y.S., Kharul U.K., Somani S.P., and Kumbharkar S.C. Benzoylation of polyphenylene oxide: characterization and gas permeability investigations. Eur Polym J 41 (2005) 2461-2471
12. Chawdhury G., Vujosevic R., Matsuura T., and Laverty B. Effects of polymer molecular weight and chemical modification on the gas transport properties of poly(2,6-dimethyl-1,4-phenylene oxide). J Appl Polym Sci 77 (2000) 1137-1143
13. Lin C.H., Jiang Z.R., and Wang C.S. Low dielectric thermoset. II. Synthesis and properties of novel 2, 6-dimethyl phenol-dipentene epoxy. J Polym Sci Part A: Polym Chem 40 (2002) 4084-4097
14. Lin K.Y., Su C.T., Wang L.J., Huang C.J., and Liang M. New manganese catalyzed regiocontrolled synthesis of poly(2,5-dialkyl-1,4-phenylene oxide)s. J Appl Polym Sci 111 (2009) 1501-1507
15. Lee T.Z., Fang Y.D., Yuan W.G., Wei K.M., and Liang M. Synthesis, structures and thermal properties of new class epoxide-terminated telechelic poly(2,6-dimethyl-1,4-phenylene oxide)s. Polymer 48 (2007) 734-742
16. ASTM Standard D1652-90, Annual Book of ASTM Standards; 1990. p. 28-30.
17. Kobayashia S., and Higashimura H. Oxidative polymerization of phenols revisited. Prog Polym Sci 28 (2003) 1015-1048
18. Hay A.S. Polymerization by oxidative coupling: discovery and commercialization of PPO and Noryl resins. J Polym Sci Part A: Polym Chem 36 (1998) 505-517
19. Lee J.R., Jin F.L., Park S.J., and Park J.M. Study of new fluorine-containing epoxy resin for low dielectric constant. Surf Coat Technol 180-181 (2004) 650-654
20. Deligoz H., Ozgumus S., Yalcnyuva T., Yild1rim S., Deger D., and Ulutas K. A novel cross-linked polyimide film: synthesis and dielectric properties. Polymer 46 (2005) 3720-3729
21. Abd-El-Messieh S.L., El-Sabbagh S., and Abadir I.F. Dielectric relaxation and mechanical investigation of ethylene propylene diene monomer rubber with some crosslinking additives. J Appl Polym Sci 73 (1999) 1509-1519
22. Hougham G., Tesoro G., and Viehbeck A. Influence of free volume change on the relative permittivity and refractive index in fluoropolyimides. Macromolecules 29 (1996) 3453-3456
23. Chern Y.T., and Shiue H.C. Low dielectric constants of soluble polyimides based on adamantane. Macromolecules 30 (1997) 4646-4651
24. Hougham G., Tesoro G., and Shaw J. Synthesis and properties of highly fluorinated polyimides. Macromolecules 27 (1994) 3642-3649
25. Levita G., Liv1 A., Rolla P.A., and Culicchi C. Dielectric monitoring of epoxy cure. J Polym Sci Part B: Polym Phys 34 (1996) 2731-2737
26. Yung K.C., Zhu B.L., Yue T.M., and Xie C.S. Preparation and properties of hollow glass microsphere-filled epoxy-matrix composites. Compos Sci Technol 69 (2009) 260-264