Low dielectric epoxy resins from dicyclopentadiene-containing poly(phenylene oxide) novolac cured with dicyclopentadiene containing epoxy

Reactive and Functional Polymers

Volumn 68, Issue 8, 2008, Pages 1185-1193

  Hwang, Hann Jang ^a   Hsu, Su Wen ^b   Chung, Chia Lung ^b   Wang, Chun Shan ^b  

^a CHUNG HWA UNIVERSITY OF MEDICAL TECHNOLOGY   (Taiwan)

^b NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Dicyclopentadiene; Dielectric constant; Poly(phenylene oxide); Redistribution; Thermal properties

Indexed keywords

ABSORPTION; AROMATIC COMPOUNDS; CERAMIC CAPACITORS; CURING; DIELECTRIC PROPERTIES; DRYING; ENZYMES; EPOXY RESINS; GLASS TRANSITION; MOLECULAR WEIGHT; MOLECULES; PHENOLS; RESINS; THERMAL EXPANSION; THERMAL SPRAYING; TOLUENE; WEIGHING;

(PL) PROPERTIES; BENZOYL PEROXIDE (BPO); BISPHENOL-A (BPA); COEFFICIENT OF THERMAL EXPANSION (CLTE); DICYCLOPENTADIENE (DCPD); DIELECTRIC CONSTANTS; DIPHENYLMETHANE (DPM); ELSEVIER (CO); EPOXY SYSTEMS; GLASS TRANSITION TEMPERATURE (TG); LOW DIELECTRICS; LOW-MOLECULAR-WEIGHT (LMW); MOISTURE ABSORPTIONS; NETWORK SYSTEMS; NOVOLAC; PHENOLIC HYDROXYL GROUPS; POLYPHENYLENE OXIDE (PPO); THERMAL STABILITY;

PAINTING;

EID: 47749156370     PISSN: 13815148     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.reactfunctpolym.2008.05.001     Document Type: Review

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