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Volumn 45, Issue 3, 2004, Pages 843-847

Synthesis of thermosetting poly(phenylene ether) containing allyl groups

Author keywords

Dielectric properties; Low k materials; Oxidative coupling polymerization

Indexed keywords

COPOLYMERIZATION; COPOLYMERS; CROSSLINKING; GLASS TRANSITION; HEAT TREATMENT; MOLECULAR WEIGHT; NUCLEAR MAGNETIC RESONANCE SPECTROSCOPY; PERMITTIVITY; SYNTHESIS (CHEMICAL);

EID: 0742287098     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2003.11.025     Document Type: Article
Times cited : (58)

References (10)
  • 2
    • 0742272379 scopus 로고
    • Polymers for electronic packing and interconection
    • J.H. Lupinski, & R.S. Moore. Washington DC: American Chemical Society
    • Goff D.L., Yuan E.L., Long H., Neuhaus H.J. Lupinski J.H., Moore R.S. Polymers for electronic packing and interconection. ACS Symposium Series 407. 1989;93 American Chemical Society, Washington DC.
    • (1989) ACS Symposium Series 407 , pp. 93
    • Goff, D.L.1    Yuan, E.L.2    Long, H.3    Neuhaus, H.J.4
  • 6
    • 0002838502 scopus 로고
    • Microelectronics technology
    • E. Reichmanis, C.K. Ober, S.A. MacDonald, T. Iwayanagi, & T. Nishikubo. Washington DC: American Chemical Society
    • Ishii Y., Oda H., Arai T., Katayose T. Reichmanis E., Ober C.K., MacDonald S.A., Iwayanagi T., Nishikubo T. Microelectronics technology. ACS Symposium Series 614. 1995;485 American Chemical Society, Washington DC.
    • (1995) ACS Symposium Series 614 , pp. 485
    • Ishii, Y.1    Oda, H.2    Arai, T.3    Katayose, T.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.