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Volumn 33, Issue 2, 2010, Pages 443-452

CFD analyses of a notebook computer thermal management system and a proposed passive cooling alternative

Author keywords

Computational fluid dynamics; Conjugate heat transfer; Notebook computer; Passive cooling; System packaging; Thermal management

Indexed keywords

CONJUGATE HEAT TRANSFER; NOTE-BOOK COMPUTER; PASSIVE COOLING; SYSTEM PACKAGING; THERMAL MANAGEMENT;

EID: 77953476279     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2010.2044505     Document Type: Article
Times cited : (26)

References (29)
  • 1
    • 77953476615 scopus 로고    scopus 로고
    • Methods, metrics and motivation for a green computer science program
    • Mar.
    • M. Talebi and T. Way, "Methods, metrics and motivation for a green computer science program," ACM Special Interest Group Comput. Sci. Educ. Bull., vol.41, no.1, pp. 362-366, Mar. 2009.
    • (2009) ACM Special Interest Group Comput. Sci. Educ. Bull. , vol.41 , Issue.1 , pp. 362-366
    • Talebi, M.1    Way, T.2
  • 2
    • 0030169633 scopus 로고    scopus 로고
    • Forced convection air-cooling of a commercial electronic chassis: An experimental and computational case study
    • Jun.
    • C. W. Argento, Y. K. Joshi, and M. D. Osterman, "Forced convection air-cooling of a commercial electronic chassis: An experimental and computational case study," IEEE Trans. Compon. Packag. Manuf. Technol. A, vol.19, no.2, pp. 248-257, Jun. 1996.
    • (1996) IEEE Trans. Compon. Packag. Manuf. Technol. A , vol.19 , Issue.2 , pp. 248-257
    • Argento, C.W.1    Joshi, Y.K.2    Osterman, M.D.3
  • 3
    • 0035005434 scopus 로고    scopus 로고
    • Thermal design of a desktop computer system using CFD analysis
    • C.-W. Yu and R. L. Webb, "Thermal design of a desktop computer system using CFD analysis," in Proc. 17th IEEE Semi-Therm Symp., 2001, pp. 18-26.
    • (2001) Proc. 17th IEEE Semi-Therm Symp. , pp. 18-26
    • Yu, C.-W.1    Webb, R.L.2
  • 4
    • 54849376300 scopus 로고    scopus 로고
    • Forced air cooling of CPUs with heat sinks: A numerical study
    • Sep.
    • E. Ozturk and I. Tari, "Forced air cooling of CPUs with heat sinks: A numerical study," IEEE Trans. Compon. Packag. Technol., vol.31, no.3, pp. 650-660, Sep. 2008.
    • (2008) IEEE Trans. Compon. Packag. Technol. , vol.31 , Issue.3 , pp. 650-660
    • Ozturk, E.1    Tari, I.2
  • 6
    • 0030110103 scopus 로고    scopus 로고
    • Thermal solution to Pentium processors in TCP in notebooks and sub-notebooks
    • Mar.
    • H. Xie, M. Aghazadeh, W. Lui, and K. Haley, "Thermal solution to Pentium processors in TCP in notebooks and sub-notebooks," IEEE Trans. Compon. Packag. Manuf. Technol. A, vol.19, no.1, pp. 201-210, Mar. 1996.
    • (1996) IEEE Trans. Compon. Packag. Manuf. Technol. A , vol.19 , Issue.1 , pp. 201-210
    • Xie, H.1    Aghazadeh, M.2    Lui, W.3    Haley, K.4
  • 7
    • 0031162142 scopus 로고    scopus 로고
    • Thermal modeling of high performance packages in portable computers
    • Jun.
    • R. Viswanath and I. A. Ali, "Thermal modeling of high performance packages in portable computers," IEEE Trans. Compon. Packag. Manuf. Technol. A, vol.20, no.2, pp. 230-240, Jun. 1997.
    • (1997) IEEE Trans. Compon. Packag. Manuf. Technol. A , vol.20 , Issue.2 , pp. 230-240
    • Viswanath, R.1    Ali, I.A.2
  • 10
    • 33846015962 scopus 로고    scopus 로고
    • Thermal design for notebook PC by using thermal analysis
    • Available
    • M.-I. Baek and J.-M. Lee, "Thermal design for notebook PC by using thermal analysis," in Proc. 9th Int. FLOTHERM User Conf., 2000. Available: http://209.128.93.33/flotherm/technical papers/index 201-300.jsp
    • (2000) Proc. 9th Int. FLOTHERM User Conf.
    • Baek, M.-I.1    Lee, J.-M.2
  • 11
    • 0036504114 scopus 로고    scopus 로고
    • Thermal characterization of compact electronic systems: A portable PC as a study case
    • Mar.
    • E. Dallago and G. Venchi, "Thermal characterization of compact electronic systems: A portable PC as a study case," IEEE Trans. Power Electr., vol.17, no.2, pp. 187-195, Mar. 2002
    • (2002) IEEE Trans. Power Electr. , vol.17 , Issue.2 , pp. 187-195
    • Dallago, E.1    Venchi, G.2
  • 12
    • 77953480513 scopus 로고    scopus 로고
    • Aug. 4, [Online]. Available
    • Intel Processors by Family Webpage (2009, Aug. 4) [Online]. Available: http://ark.intel.com/Default.aspx.
    • (2009) Intel Processors by Family Webpage
  • 15
    • 0036767972 scopus 로고    scopus 로고
    • Characterization of laminar jet impingement cooling in portable computer applications
    • Sep.
    • J. R. Guarino and V. P. Manno, "Characterization of laminar jet impingement cooling in portable computer applications," IEEE Trans. Compon. Packag. Technol., vol.25, no.3, pp. 337-346, Sep. 2002.
    • (2002) IEEE Trans. Compon. Packag. Technol. , vol.25 , Issue.3 , pp. 337-346
    • Guarino, J.R.1    Manno, V.P.2
  • 16
    • 20344399887 scopus 로고    scopus 로고
    • Thermoelectricpowered convective cooling of microprocessors
    • May
    • K. Yazawa, G. L. Solbrekken, and A. Bar-Cohen, " Thermoelectricpowered convective cooling of microprocessors," IEEE Trans. Adv. Packag., vol.28, no.2, pp. 231-239, May 2005.
    • (2005) IEEE Trans. Adv. Packag. , vol.28 , Issue.2 , pp. 231-239
    • Yazawa, K.1    Solbrekken, G.L.2    Bar-Cohen, A.3
  • 21
    • 77953477390 scopus 로고    scopus 로고
    • Transmeta Corporation, Santa Clara, CA, Jun.
    • TM5500/TM5800 Thermal Design Guide, Transmeta Corporation, Santa Clara, CA, Jun. 2002, pp. 55-59.
    • (2002) TM5500/TM5800 Thermal Design Guide , pp. 55-59
  • 25
    • 0038970642 scopus 로고    scopus 로고
    • Thermal performance of integrated plate heat pipe with a heat spreader
    • Sep.
    • K. Take and R. L. Webb, "Thermal performance of integrated plate heat pipe with a heat spreader," J. Electron. Packag., vol.123, no.3, pp. 189-195, Sep. 2001.
    • (2001) J. Electron. Packag. , vol.123 , Issue.3 , pp. 189-195
    • Take, K.1    Webb, R.L.2
  • 26
    • 34548575731 scopus 로고    scopus 로고
    • Optimum fin spacing of rectangular fins on a vertical base in free convection heat transfer
    • Jan.
    • B. Yaziciöglu and H. Yüncü, "Optimum fin spacing of rectangular fins on a vertical base in free convection heat transfer," Heat Mass Transfer, vol.44, no.1, pp. 11-21, Jan. 2007.
    • (2007) Heat Mass Transfer , vol.44 , Issue.1 , pp. 11-21
    • Yaziciöglu, B.1    Yüncü, H.2
  • 28
    • 70350274583 scopus 로고    scopus 로고
    • Passive cooling assembly for flat panel displays with integrated high power components
    • Aug.
    • I. Tari, "Passive cooling assembly for flat panel displays with integrated high power components," IEEE Trans. Consumer Electron., vol.55, no.3, pp. 1707-1713, Aug. 2009.
    • (2009) IEEE Trans. Consumer Electron. , vol.55 , Issue.3 , pp. 1707-1713
    • Tari, I.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.