Thermal performance of integrated plate heat pipe with a heat spreader

Journal of Electronic Packaging

Volumn 123, Issue 3, 2001, Pages 189-195

  Take, Koichiro ^a   Webb, Ralph L ^b  

^a Showa Denko Materials Co   (Japan)

^b The Pennsylvania State University   (United States)

Author keywords

Heat pipe; Heat spreader; Passive cooling

Indexed keywords

EID: 0038970642     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1348010     Document Type: Article

References (8)

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6. Intel Corporation, 1998, "Mobile Pentium II Processor at 233 MHz, 266 MHz, and 300 MHz," Order No. 243669-002.
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8. Faghri, A., and Parvani, S., 1998, "Numerical Analysis of Laminar Flow in a Double-Walled Annular Heat Pipe," AIAA J. Thermophys. Heat Transfer, 2, No. 3, pp. 165-171.