Advanced cooling system using miniature heat pipes in mobile PC

IEEE Transactions on Components and Packaging Technologies

Volumn 23, Issue 1, 2000, Pages 86-90

  Nguyen, Thang ^a   Mochizuki, Masataka ^a   Mashiko, Koichi ^a   Saito, Yuji ^a   Sauciuc, Loan ^a   Boggs, Rex ^a  

^a FUJIKURA LTD   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

COOLING SYSTEMS; HEAT LOSSES; HEAT PIPES; HEAT RESISTANCE; HEAT SINKS; THERMOANALYSIS;

HEAT SPREADER PLATES; HINGED HEAT PIPE SYSTEMS;

LAPTOP COMPUTERS;

EID: 0033872796     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.833046     Document Type: Article

References (5)

1. P.D. Dünn and D.A. Reay, Heat Pipe, 3rd ed. New York: Pergamon, 1982.
2. A. Faghri, Heat Pipe Science and Technology. New York: Taylor and Francis, 1995.
3. P. Ho, M. Mochizuki, and T. Nguyen, "Hinged heat pipe for cooling notebook PCs," in Proc. Semi-Therm, 13th Anna. IEEE, Semiconductor Thermal Measurement Management Symp., Austin, TX, Jan. 28-30, 1997.
4. H. Xie, M. Aghazadeh, W. Lui, and K. Haley, "Thermal solution to pentium processors in TCP in notebooks and sub-notebooks," IEEE, Trans. Comp., Packag., Manufact. Technol. A, vol. 19, pp. 201-210, Mar. 1996.
5. T. Nguyen, M. Mochizuki, K. Mashiko, Y Saito, and K. Goto, "Cooling CPU using hinged heat pipe," presented at the 5th International Heat Pipe Symposium, Melbourne, Australia, Nov. 17-20, 1996.