Thermoelectric-powered convective cooling of microprocessors

IEEE Transactions on Advanced Packaging

Volumn 28, Issue 2, 2005, Pages 231-239

  Yazawa, Kazuaki ^a   Solbrekken, Gary L ^b   Bar Cohen, Avram ^c  

^a SONY CORPORATION   (Japan)

^b University of Missouri   (United States)

^c UNIVERSITY OF MARYLAND   (United States)

Author keywords

Energy efficient; Heat sink; Microprocessor; Optimization; Power regeneration; Thermoelectric

Indexed keywords

COOLING SYSTEMS; HEAT CONVECTION; HEAT SINKS; LAPTOP COMPUTERS; OPTIMIZATION; POWER GENERATION; THERMOELECTRICITY;

ENERGY EFFICIENT; THERMOELECTRIC POWERED CONVECTIVE COOLING;

MICROPROCESSOR CHIPS;

EID: 20344399887     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2005.846854     Document Type: Article

References (21)

1. "International Technology Roadmap for Semiconductors 2000 Update," SIA, 2000.
2. K. Yazawa and A. Bar-Cohen, "Energy efficient cooling of notebook computers," in Proc. ITHERM, 2002.
3. K. Yazawa, B. Lin, and M. Okuda, "Thermal design method for a hyper heat dense notebook PC," in Proc. InterPACK, 1999, pp. 1447-1452.
4. D. M. Rowe, "The NEDO/cardiff thermoelectric project to economically recover low temperature waste heat," in Proc. 17th Int. Conf. Thermoelectrics, 1998, pp. 18-22.
5. K. Matsuura and D. M. Rowe, "Low-temperature heat conversion," in CRC Handbook of Thermoelectrics. Boca Raton, FL: CRC, 1995, pp. 573-593.
6. F. J. Weinberg, D. M. Rowe, G. Min, and P. D. Ronney, "On thermoelectric power conversion from heat re-circulating combustion systems," in Proc. Combustion Institute, vol. 29, 2002, pp. 957-963.
7. A. Shakouri and J. E. Bowers, "Heterostructure integrated thermionic coolers," Appl. Phys. Lett., vol. 71, p. 1234, 1997.
8. A. Freundlich and A. Ignatiev, "Quantum Well Thermophotovoltaic Energy Converter," U.S. Patent 6 150 604, 2000.
9. D. M. Rowe, "Thermoelectric generation," in CRC Handbook of Thermoelectrics. Boca Raton, FL: CRC, 1995, pp. 441-458.
10. H. J. Goldsmid, "Conversion efficiency and figure of merit," in CRC Handbook of Thermoelectrics. Boca Raton, FL: CRC, 1995, pp. 19-25.
11. Y. Ogawa, Analysis for Thermoelectric Conversion System Design. Tokyo, Japan: Morikita Shuppan, 1999.
12. D. W. Van De Pol and J. K. Tierney, "Free convection Nusselt number for vertical U-shaped channels," J. Heat Transfer, vol. 95, pp. 542-543, 1973.
13. A. D. Kraus and A. Bar-Cohen, Design and Analysis of Heat Sinks. New York: Wiley, 1995.
14. A. D. Kraus and A. Bar-Cohen, Thermal Analysis and Control of Electronic Equipment. St. Louis Park, MN: ABC/ADK Books, 1983.
15. M. Iyengar and A. Bar-Cohen, "Design for manufacturability of SISE parallel plate forced convection heat sinks," IEEE Trans. Compon., Packag. Technol. A, vol. 24, no. 2, pp. 150-158, Jun. 2001.
16. B. R. Munson, D. F. Young, and T. H. Okiishi, Fundamentals of Fluid Mechanics. New York: Wiley, 1990.
17. W. M. Kays and M. E. Crawford, Convective Heat and Mass Transfer, 3rd ed. New York: McGraw-Hill, 1993.
18. F. P. Incropera and D. P. DeWitt, Fundamentals of Heat and Mass Transfer, 4th ed. New York: Wiley, 1996.
19. "Product information brochure," in Micro Cooling Device. Brea, CA: Sunon, 1999.
20. L. Dubios, "An introduction to the DARPA program in advanced thermoelectric materials and devices," in Proc. 18th Int. Conf. Thermoelectrics, 1999, pp. 1-4.
21. Thermofoil Etched-Foil Heating Elements, Minco Products, Inc., Minneapolis, MN. 2002.