Energy efficient cooling of notebook computers

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 2002, Pages 785-791

  Yazawa, Kazuaki ^a   Bar Cohen, Avram ^b  

^a SONY CORPORATION   (Japan)

^b UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING SYSTEMS; FORCED CONVECTION; HEAT FLUX; LAPTOP COMPUTERS; NUMERICAL METHODS; PORTABLE EQUIPMENT;

THERMAL MANAGEMENT;

HEAT PIPES;

EID: 0036455854     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (13)

1. Gartner Press Release, "Gartner Dataquest Says 2001 is a Year Battered PC Vendors Would Rather Forget Preliminary Results Show the Market Declined for the First Time Since 1985", www.gartner.co.jp/press/pr20020118.html, 2002.
2. Bar-Cohen, A., Prstic, S., Yazawa, K. and Iyengar, M., "Design and Optimization of Forced Convection Heat Sinks for Sustainable Development", Proceedings of Euro Conference New and Renewable Technologies for sustainable development, Portugal, 2000.
3. SIA, International Technology Roadmap for Semiconductors 2000 update, 2000.
4. Kobayashi, T., Ogushi, T., Sumi, N. and Fujii, M., "Thermal Design for a Ultra-slim Notebook Computer", Proceedings of the Sixth Inter Society Conference on Thermal Phenomena, Seattle, 1998.
5. Nakayama M., "Build-Up Approach for the Thermal Design of Electronics Equipments: A JSME Project", Proceedings of Thermo Engineering Division Conference 2001 JSME, Okayama, 2001.
6. Solbrekken, G.L., Yazawa, K., Coxe, K.C., and Bar-Cohen, A., "Passive Cooling Limits for Unventilated Notebook Computers", Proceedings of The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, Hawaii, 2001.
7. Coxe, K.C., Solbrekken, G.L., Yazawa, K. and Bar-Cohen, A., "Experimental Modeling of the Passive Cooling Limit of Notebook Computers", Proceedings of the Eighth Inter Society Conference on Thermal Phenomena, San Diego, 2002.
8. Incropera, F.P. and DeWitt, D.P., Introduction to Heat transfer, John Wiley & Sons, New York, 1990.
9. Ozisik, M.N., Heat Transfer: A Basic Approach, McGraw-Hill, Inc., New York, 1985.
10. Churchill, S.W. and Chu, H.S., "Correlating Equations for Laminar and Turbulent Free Convection From a Vertical Plate", International Journal of Heat Mass Transfer, Vol. 18, 1975.
11. Iwasaki, H. and Ishizuka, M., "Forced Convection Air Cooling Characteristics of Plate Fins for Notebook Personal Computers", Proceedings from the Seventh Inter Society Conference on Thermal Phenomena, Las Vegas, 2000.
12. Yazawa, K., Lin, B. and Okuda, M., "Thermal Design Method for a Hyper Heat dense Notebook PC", Proceedings of The Pacific Rim/International, Intersociety, Electronic Packaging Technical/Business Conference & Exhibition, Hawaii, 1999.
13. th National Heat Transfer Conference 2001, Anaheim, 2001.