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Volumn 7637, Issue , 2010, Pages

Step and flash imprint lithography for semiconductor high volume manufacturing?

Author keywords

HVM; Nanoimprint; NIL; SFIL; Step and Flash; UV NIL

Indexed keywords

CRITICAL ISSUES; CURRENT STATUS; DEFECTIVITY; HIGH VOLUME MANUFACTURING; INDUSTRY COLLABORATION; INTEGRATION ISSUES; NANO-IMPRINT; NEXT GENERATION LITHOGRAPHY; RESOLUTION REQUIREMENTS; STEP-AND-FLASH IMPRINT LITHOGRAPHY; ULTRAVIOLET-NANOIMPRINT LITHOGRAPHY;

EID: 77953310489     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.846617     Document Type: Conference Paper
Times cited : (26)

References (6)
  • 5
    • 45549110244 scopus 로고    scopus 로고
    • Mask and Wafer Cost of Ownership (CoO) from 65 to 22nm Half-Pitch Nodes
    • G. Hughes, L. Litt, A. Wüest, S. Palaiyanur, "Mask and Wafer Cost of Ownership (CoO) from 65 to 22nm Half-Pitch Nodes, " in Proc. of SPIE, Vol. 7028, 2008.
    • (2008) Proc. of SPIE , vol.7028
    • Hughes, G.1    Litt, L.2    Wüest, A.3    Palaiyanur, S.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.