Fabrication and characterization of the capillary performance of superhydrophilic Cu micropost arrays

Journal of Microelectromechanical Systems

Volumn 19, Issue 3, 2010, Pages 581-588

  Nam, Youngsuk ^a   Sharratt, Stephen ^a   Byon, Chan ^b   Kim, Sung Jin ^b   Ju, Y Sungtaek ^a  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b Korea Advanced Institute of Science and Technology (KAIST)   (South Korea)

Author keywords

Cooling; Electrochemical deposition; Micro heat pipe

Indexed keywords

CHEMICAL OXIDATION; DEFECT-FREE; DENSE ARRAYS; EFFECTIVE THERMAL CONDUCTIVITY; ELECTROCHEMICAL DEPOSITION; ELECTRODEPOSITION CURRENTS; FINITE CURVATURE; MICRO HEAT PIPE; NANOSTRUCTURED COPPER; NUMERICAL SIMULATION; OPTIMAL BALANCE; ORDER OF MAGNITUDE; OXYGEN SURFACE; PHOTORESIST MOLDS; PRECISE CONTROL; RATE OF RISE; SOLID FRACTION; SUPER-HYDROPHILIC;

ASPECT RATIO; CAPILLARY FLOW; COMPUTER SIMULATION; HEAT PIPES; OXYGEN; REDUCTION;

ELECTRODEPOSITION;

EID: 77953123104     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2010.2043922     Document Type: Article

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