A novel integrated power inductor in silicon substrate for ultra-compact power supplies

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn , Issue , 2010, Pages 2036-2041

  Wang, Mingliang ^a   Li, Jiping ^a   Ngo, Khai D T ^b   Xie, Huikai ^a  

^a University of Florida   (United States)

^b State University

Author keywords

[No Author keywords available]

Indexed keywords

BUCK CONVERTERS; COPPER WINDINGS; INTEGRATED POWER; MICROMACHINING TECHNIQUES; PACKAGING SUBSTRATES; POWER SUPPLY; Q-FACTORS; ROUTINGS; SILICON SUBSTRATES; SILICON-BASED; SURFACE MOUNTING; THROUGH SILICON VIAS; WAFER LEVEL;

CHIP SCALE PACKAGES; ELECTRONIC EQUIPMENT MANUFACTURE; POWER ELECTRONICS; POWER INDUCTORS; SEMICONDUCTING SILICON COMPOUNDS; SUBSTRATES;

SILICON WAFERS;

EID: 77952233309     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/APEC.2010.5433515     Document Type: Conference Paper

References (20)

1. F. C. Lee, J. D. van Wyk, D. Boroyevich, L. Guo-Quan, L. Zhenxian, and P. Barbosa, "Technology trends toward a system-in-a-module in power electronics," Circuits and Systems Magazine, IEEE, vol. 2, pp. 4-22, 2002.
2. S. C. O. Mathuna, T. O'Donnell, W. Ningning, and K. Rinne, "Magnetics on silicon: an enabling technology for power supply on chip," Power Electronics, IEEE Transactions on, vol. 20, pp. 585-592, 2005.
3. Enpiron, "EN5322Q datasheet," 2007.
4. "LM2832 datasheet," National Semiconductor.
5. M. H. Lim, J. D. van Wyk, F. C. Lee, and K. D. T. Ngo, "A Class of Ceramic-Based Chip Inductors for Hybrid Integration in Power Supplies," Power Electronics, IEEE Transactions on, vol. 23, pp. 1556-1564, 2008.
6. T. Mikura, K. Nakahara, K. Ikeda, K. Furukuwa, and K. Onitsuka, "New substrate for micro DC-DC converter," in Electronic Components and Technology Conference, 2006. Proceedings. 56th, 2006, p. 5 pp.
7. H. J. Bergveld, R. Karadi, and K. Nowak, "An inductive down converter system-in-package for integrated power management in battery-powered applications," in Power Electronics Specialists Conference, 2008. PESC 2008. IEEE, 2008, pp. 3335-3341.
8. Z. Hayashi, Y. Katayama, M. Edo, and H. Nishio, "High-efficiency dc-dc converter chip size module with integrated soft ferrite," Magnetics, IEEE Transactions on, vol. 39, pp. 3068-3072, 2003.
9. P. Hazucha, G. Schrom, H. Jaehong, B. A. Bloechel, P. Hack, G. E. Dermer, S. Narendra, D. Gardner, T. Karnik, V. De, and S. Borkar, "A 233-MHz 80%-87% efficient four-phase DC-DC converter utilizing air-core inductors on package," Solid-State Circuits, IEEE Journal of, vol. 40, pp. 838-845, 2005.
10. G. Schrom, P. Hazucha, F. Paillet, D. J. Rennie, S. T. Moon, D. S. Gardner, T. Kamik, P. Sun, T. T. Nguyen, M. J. Hill, K. Radhakrishnan, and T. Memioglu, "A 100MHz Eight-Phase Buck Converter Delivering 12A in 25mm2 Using Air-Core Inductors," in Applied Power Electronics Conference, APEC 2007-Twenty Second Annual IEEE, 2007, pp. 727-730.
11. Y. Katayama, S. Sugahara, H. Nakazawa, and M. Edo, "High- powerdensity MHz-switching monolithic DC-DC converter with thin-film inductor," in Power Electronics Specialists Conference, 2000. PESC 00. 2000 IEEE 31st Annual, 2000, pp. 1485-1490 vol.3.
12. L. Weidong, S. Yuqin, and C. R. Sullivan, "High-frequency resistivity of soft magnetic granular films," Magnetics, IEEE Transactions on, vol. 41, pp. 3283-3285, 2005. (Pubitemid 41584423)
13. M. Wang, K. D. T. Ngo, and H. Xie, "SU-8 enhanced high power density MEMS inductors," in Industrial Electronics, 2008. IECON 2008. 34th Annual Conference of IEEE, Orlando, FL, 2008, pp. 2672-2676.
14. J. Y. Park and M. G. Allen, "Integrated electroplated micromachined magnetic devices using low temperature fabrication processes," Electronics Packaging Manufacturing, IEEE Transactions on [see also Components, Packaging and Manufacturing Technology, Part C: Manufacturing, IEEE Transactions on], vol. 23, pp. 48-55, 2000.
15. C. H. Ahn and M. G. Allen, "Micromachined planar inductors on silicon wafers for MEMS applications," Industrial Electronics, IEEE Transactions on, vol. 45, pp. 866-876, 1998.
16. M. Wang, I. Batarseh, K. D. T. Ngo, and H. Xie, "Design and Fabrication of Integrated Power Inductor Based on Silicon Molding Technology," in Power Electronics Specialists Conference, 2007. PESC 2007. IEEE, 2007, pp. 1612-1618.
17. T. O'Donnell, N. Wang, R. Meere, F. Rhen, S. Roy, D. O'Sullivan, and C. O'Mathuna, "Microfabricated inductors for 20 MHz Dc-Dc converters," in Applied Power Electronics Conference and Exposition, 2008. APEC 2008. Twenty-Third Annual IEEE, 2008, pp. 689-693.
18. K. W. Moon, S. H. Hong, H. J. Kim, and J. Kim, "A fabrication of DC-DC converter using LTCC NiZnCu ferrite thick films," in Magnetics Conference, 2005. INTERMAG Asia 2005. Digests of the IEEE International, 2005, pp. 1109-1110.
19. I. Kowase, T. Sato, K. Yamasawa, and Y. Miura, "A planar inductor using Mn-Zn ferrite/polyimide composite thick film for low-Voltage and large-current DC-DC converter," Magnetics, IEEE Transactions on, vol. 41, pp. 3991-3993, 2005. (Pubitemid 41584632)
20. M. Wang, K. D. T. Ngo, I. Batarseh, and H. Xie, "Integrated Power Inductor with Silicon Substrate Molding," in Asia-Pacific Conference on Transducers and Micro-nano Technology APCOT Singapore, 2006.