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Enhancement of thermal fatigue reliability of power semiconductor interconnects using dimple-array solder joints
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Embedded power - A multi-layer integration technology for packaging of IPEMs and PEBBs
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Integration of a 1MHz converter with active and passive stages
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J. D. van Wyk, S. Wen, Z. Liang, J. T. Strydom, S-Y. Lee, H. Odendaal, and D. A. Huff, "The Development of Planar High Density Hybrid Integration Technologies for Power Electronics", Proceedings, 10th International Conference on Power Electronics and Motion Control EPE-PEMC, Cavtat, Paper SSJAF-01, 14 pp, 2002.
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Integrated electrical and thermal analysis of integrated power electronics modules using iSIGHT
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Paper SSJAF-05
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D. Boroyevich and J. Z. Chen, "Integrated Multidisciplinary Modeling, Analysis and Design in Power Electronics", Proceedings, 10th International Conference on Power Electronics and Motion Control EPE-PEMC, Cavtat, Paper SSJAF-05, 10 pp, 2002.
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