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Volumn 2, Issue 4, 2002, Pages 4-23

Technology trends toward a system-in-a-module in power electronics

Author keywords

[No Author keywords available]

Indexed keywords

GATE DRIVING FUNCTIONS; INTEGRATED POWER ELECTRONICS MODULES; INTERNAL SENSING;

EID: 1242327457     PISSN: 1531636X     EISSN: None     Source Type: Journal    
DOI: 10.1109/MCAS.2002.1173132     Document Type: Article
Times cited : (103)

References (26)
  • 1
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    • The future of power semiconductor device technology
    • June
    • B. J. Baliga, "The Future of Power Semiconductor Device Technology", IEEE Proceedings, vol. 89, no. 6, pp. 822-832, June 2001.
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    • Baliga, B.J.1
  • 4
    • 85008048043 scopus 로고    scopus 로고
    • Power electronics technology: Present trends and future developments
    • June
    • J. D. van Wyk, F. C. Lee, and D. Boroyevich, "Power Electronics Technology: Present Trends and Future Developments", IEEE Proceedings, vol. 89, no. 6, pp. 799-802, June 2001.
    • (2001) IEEE Proceedings , vol.89 , Issue.6 , pp. 799-802
    • Van Wyk, J.D.1    Lee, F.C.2    Boroyevich, D.3
  • 5
    • 0000157640 scopus 로고    scopus 로고
    • Special issue on limits of semiconductor technology
    • J. Meindl, "Special Issue on Limits of Semiconductor Technology", IEEE Proceedings, vol. 89, no. 3, pp. 223-226, 2001.
    • (2001) IEEE Proceedings , vol.89 , Issue.3 , pp. 223-226
    • Meindl, J.1
  • 7
    • 0000724696 scopus 로고    scopus 로고
    • Packaging of integrated solid-state power assembly cells: A thermo-mechanics based approach
    • June
    • M. C. Shaw and B. C. Beihoff, "Packag ing of Integrated Solid-State Power Assembly Cells: A Thermo-Mechanics Based Approach", IEEE Proceedings, vol. 89, no. 6, pp. 856-863, June 2001.
    • (2001) IEEE Proceedings , vol.89 , Issue.6 , pp. 856-863
    • Shaw, M.C.1    Beihoff, B.C.2
  • 8
    • 0002910205 scopus 로고
    • Some present and future trends in power electronic converters
    • J. D. van Wyk and J. A. Ferreira, "Some Present and Future Trends in Power Electronic Converters", Proceedings IEEE-IECON'92, vol. 1, pp. 9-18, 1992.
    • (1992) Proceedings IEEE-IECON'92 , vol.1 , pp. 9-18
    • Van Wyk, J.D.1    Ferreira, J.A.2
  • 11
    • 0034794343 scopus 로고    scopus 로고
    • Enhancement of thermal fatigue reliability of power semiconductor interconnects using dimple-array solder joints
    • S. Wen, D. Huff, and G-Q Lu, "Enhancement of Thermal Fatigue Reliability of Power Semiconductor Interconnects Using Dimple-Array Solder Joints", Proceedings IEEE 32nd Annual Power Electronics Specialists Conference (PESC01), vol. 4, pp. 1926-1931, 2001.
    • (2001) Proceedings IEEE 32nd Annual Power Electronics Specialists Conference (PESC01) , vol.4 , pp. 1926-1931
    • Wen, S.1    Huff, D.2    Lu, G.-Q.3
  • 16
  • 17
    • 0036444551 scopus 로고    scopus 로고
    • Volumetric optimal design of pas sive Integrated Power Electronic Module (IPEM) for Distributed Power System (DPS) front-end DC/DC converter
    • R. Chen, F. Candes, B. Yang, J.D. van Wyk, "Volumetric Optimal Design of Pas sive Integrated Power Electronic Module (IPEM) for Distributed Power System (DPS) Front-End DC/DC Converter", Conference Record IEEE Industry Applications Conference (IAS 2002), vol. 3, pp. 1758-1765, 2002.
    • (2002) Conference Record IEEE Industry Applications Conference (IAS 2002) , vol.3 , pp. 1758-1765
    • Chen, R.1    Candes, F.2    Yang, B.3    Van Wyk, J.D.4
  • 20
    • 0033882843 scopus 로고    scopus 로고
    • An overview to integrated power module design for high power electronics packaging
    • A. B. Lostetter, F. Barlow, and E. Elshabini, "An Overview to Integrated Power Module Design for High Power Electronics Packaging", Microelectronics Reliability, vol. 40, no. 3, pp. 365-379, 2000.
    • (2000) Microelectronics Reliability , vol.40 , Issue.3 , pp. 365-379
    • Lostetter, A.B.1    Barlow, F.2    Elshabini, E.3
  • 21
    • 0035437353 scopus 로고    scopus 로고
    • Packages go vertical
    • August
    • H. Goldstein, "Packages Go Vertical", IEEE Spectrum, pp. 46-51, August 2001.
    • (2001) IEEE Spectrum , pp. 46-51
    • Goldstein, H.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.