Technique for immobilizing copper ions on a substrate through a nanoscale thin film containing pyrrole groups

Journal of Chemical Engineering of Japan

Volumn 43, Issue 4, 2010, Pages 406-412

  Ohkubo, Yuji ^a,b   Onishi, Shogo ^a   Ohtake, Tadashi ^a   Ogawa, Kazufumi ^a  

^a KAGAWA UNIVERSITY   (Japan)

^b Kagawa Gakusei Venture Ltd   (Japan)

Author keywords

Chemically adsorbed monolayer; Copper; Immobilization; Oxidative polymerization; Pyrrole

Indexed keywords

ADSORBED MONOLAYERS; CHEMICALLY ADSORBED MONOLAYER; COPPER IONS; NANO SCALE; NANOSCALE THIN FILMS; NITROGEN ATOM; OXIDATIVE POLYMERIZATION; PLATING INDUSTRY; PYRROLE GROUPS; PYRROLYL; SILICON SUBSTRATES; WATER CONTACT ANGLE; XPS; XPS SPECTRA;

ADSORPTION; ANGLE MEASUREMENT; BINDING ENERGY; CAMS; CONTACT ANGLE; COPPER; COPPER COMPOUNDS; FILM THICKNESS; MAGNETIC FILMS; METAL IONS; MONOLAYERS; NANOSTRUCTURED MATERIALS; NITROGEN COMPOUNDS; POLYMERIZATION; POLYMERS; POLYPYRROLES; SUBSTRATES; THICKNESS MEASUREMENT; THIN FILMS; VAPOR DEPOSITION; X RAY PHOTOELECTRON SPECTROSCOPY;

FILM PREPARATION;

EID: 77951739767     PISSN: 00219592     EISSN: None     Source Type: Journal    
DOI: 10.1252/jcej.09we173     Document Type: Article

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