Multilayer global routing with via and wire capacity considerations

IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems

Volumn 29, Issue 5, 2010, Pages 685-696

  Hsu, Chin Hsiung ^a   Chen, Huang Yu ^b   Chang, Yao Wen ^a  

^a NATIONAL TAIWAN UNIVERSITY   (Taiwan)

^b TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY   (Taiwan)

Author keywords

Congestion; Global routing; Layout; Physical design

Indexed keywords

DETAILED ROUTING; GLOBAL ROUTERS; GLOBAL ROUTING; HIGH QUALITY; LARGE-SCALE CIRCUITS; MULTIPLE METALS; PHYSICAL DESIGN; ROUTABILITY; ROUTING CONGESTION; SIMPLIFIED MODELS;

DESIGN; ROUTERS;

ROUTING PROTOCOLS;

EID: 77951698650     PISSN: 02780070     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAD.2010.2043575     Document Type: Article

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