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Volumn 1, Issue , 2001, Pages 307-313

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

Author keywords

[No Author keywords available]

Indexed keywords

CRACK INITIATION; EUTECTICS; MICROSTRUCTURE; SCANNING ELECTRON MICROSCOPY; SHEAR STRENGTH; STRAIN RATE; STRESSES; SURFACE MOUNT TECHNOLOGY;

EID: 0347569528     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (9)
  • 2
    • 0001860532 scopus 로고
    • Mechanical Properties of Solders and Solder Joints
    • Stone, K.R. et al., 1983, "Mechanical Properties of Solders and Solder Joints," Brazing and Soldering, 4, pp. 20-27.
    • (1983) Brazing and Soldering , vol.4 , pp. 20-27
    • Stone, K.R.1
  • 3
    • 0024887607 scopus 로고
    • Mechanical Behavior of 60/40 Tin-Lead Solder Lap Joints
    • Enke, N.F. et al., 1989, "Mechanical Behavior of 60/40 Tin-Lead Solder Lap Joints," IEEE Trans. Comp., Hybr. and Manuf. Tech., 12, pp. 459-468.
    • (1989) IEEE Trans. Comp., Hybr. and Manuf. Tech. , vol.12 , pp. 459-468
    • Enke, N.F.1
  • 5
    • 0000995651 scopus 로고
    • Deformation Behavior During Low Cycle Fatigue Testing of 60Sn-40Pb Solders
    • Sandstrom, R. et al., 1993, "Deformation Behavior During Low Cycle Fatigue Testing of 60Sn-40Pb Solders," Mater. Sci. Tech., 9, pp. 811-819.
    • (1993) Mater. Sci. Tech. , vol.9 , pp. 811-819
    • Sandstrom, R.1
  • 6
    • 0033534264 scopus 로고    scopus 로고
    • A shear Test Method to Measure Shear Strength of Metallic Materials and Solder Joints Using Small Specimen
    • Unal, O., Barnard, D.J. and Anderson, I.E., 1999, "A shear Test Method to Measure Shear Strength of Metallic Materials and Solder Joints Using Small Specimen," Scripta Metall., 40, pp. 271-276.
    • (1999) Scripta Metall. , vol.40 , pp. 271-276
    • Unal, O.1    Barnard, D.J.2    Anderson, I.E.3
  • 7
    • 0032048931 scopus 로고    scopus 로고
    • Sensitivity Study on Material Properties for the Fatigue Life Prediction of Solder Joints under Cyclic Thermal Loading
    • Lee, S.-W.R. and Zhang, X., 1998, "Sensitivity Study on Material Properties for the Fatigue Life Prediction of Solder Joints under Cyclic Thermal Loading," Circuit World, 24, pp. 26-31.
    • (1998) Circuit World , vol.24 , pp. 26-31
    • Lee, S.-W.R.1    Zhang, X.2
  • 8
    • 0032022812 scopus 로고    scopus 로고
    • A Finite Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
    • Reinikainen, T. et al., 1998, "A Finite Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints," J. Elec. Pack., 120, pp. 106-113.
    • (1998) J. Elec. Pack. , vol.120 , pp. 106-113
    • Reinikainen, T.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.