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Volumn , Issue , 2009, Pages 84-90

Design and test strategies for microarchitectural post-fabrication tuning

Author keywords

[No Author keywords available]

Indexed keywords

CHIP PERFORMANCE; CRITICAL DELAYS; ENERGY EFFICIENT; FABRICATED CHIPS; INTEGRATED FRAMEWORKS; MICRO ARCHITECTURES; ON CHIPS; POST-FABRICATION; POWER DISTRIBUTIONS; PROCESS VARIATION; RANDOM VARIATION; REGRESSION MODEL; STATISTICAL ANALYSIS; SYSTEMATIC VARIATION; TECHNOLOGY SCALING; TEST STRATEGIES; TESTING FRAMEWORK; TESTING TIME;

EID: 77951014823     PISSN: 10636404     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICCD.2009.5413170     Document Type: Conference Paper
Times cited : (1)

References (11)
  • 1
    • 0036474722 scopus 로고    scopus 로고
    • Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration
    • February
    • K. Bowman, S. Duvall, and J. Meindl, "Impact of die-to-die and within-die parameter fluctuations on the maximum clock frequency distribution for gigascale integration," Journal of Solid-State Circuits, vol.37, no.2, February 2002.
    • (2002) Journal of Solid-State Circuits , vol.37 , Issue.2
    • Bowman, K.1    Duvall, S.2    Meindl, J.3
  • 3
    • 40349098498 scopus 로고    scopus 로고
    • Mitigating the impact of process variations on processor register files and execution units
    • December
    • X. Liang and D. Brooks, "Mitigating the impact of process variations on processor register files and execution units," in 39th IEEE International Symposium on Microarchitecture, December 2006.
    • (2006) 39th IEEE International Symposium on Microarchitecture
    • Liang, X.1    Brooks, D.2
  • 5
    • 52649164769 scopus 로고    scopus 로고
    • Revival: Variation tolerant architecture using voltage interpolation and variable latency
    • June
    • X. Liang, G. Wei, and D. Brooks, "ReVIVaL: Variation tolerant architecture using voltage interpolation and variable latency," in International Symposium on Computer Architecture, June 2008.
    • (2008) International Symposium on Computer Architecture
    • Liang, X.1    Wei, G.2    Brooks, D.3
  • 7
    • 0142071666 scopus 로고    scopus 로고
    • Wafer-package test mix for optimal defect detection and test time savings
    • P. C. Maxwell, "Wafer-package test mix for optimal defect detection and test time savings," in Design and Test of Computers, IEEE vol.20 (5) pp. 84-89, 2003.
    • (2003) Design and Test of Computers, IEEE , vol.20 , Issue.5 , pp. 84-89
    • Maxwell, P.C.1
  • 10
    • 0034316092 scopus 로고    scopus 로고
    • Power-aware microarchitecture: Design and modeling challenges for next-generation microprocessors
    • , Nov/Dec
    • D. Brooks et al., "Power-aware microarchitecture: Design and modeling challenges for next-generation microprocessors," IEEE Micro, vol.20, no.6, pp. 26-44, Nov/Dec 2000.
    • (2000) IEEE Micro , vol.20 , Issue.6 , pp. 26-44
    • Brooks, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.