Effect of plasma cleaning process in the wettability of flip chip PBGA substrate of integrated circuit packages

Journal of Applied Sciences

Volumn 10, Issue 9, 2010, Pages 772-776

  Amin, N ^a,b   Cheah, A Y ^a   Ahmad, I ^c  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

^b KING SAUD UNIVERSITY   (Saudi Arabia)

^c Universiti Tenaga Nasional   (Malaysia)

Author keywords

Flip chip; PBGA; Plasma cleaning; Semiconductor packaging; Wettability

Indexed keywords

FLIP CHIP; INTEGRATED CIRCUIT PACKAGE; INTEGRATED CIRCUIT PACKAGING; PACKAGING SUBSTRATES; PBGA; PLASMA CLEANING; SEMICONDUCTOR PACKAGING; SUBSTRATE SURFACE;

CHIP SCALE PACKAGES; CLEANING; CONTACT ANGLE; PLASMAS; WETTING;

SUBSTRATES;

EID: 77950908314     PISSN: 18125654     EISSN: 18125662     Source Type: Journal    
DOI: 10.3923/jas.2010.772.776     Document Type: Article

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