Correlation between thermal diffusivity and activation energy of ordering of lead free solder alloys Sn65-xAg25 Sb10Cux rapidly solidified from molten state

Journal of Materials Science: Materials in Electronics

Volumn 16, Issue 4, 2005, Pages 187-191

  Shalaby, R M ^a  

^a Mansoura University   (Egypt)

Author keywords

[No Author keywords available]

Indexed keywords

ACTIVATION ENERGY; COMPOSITION EFFECTS; COPPER; DIFFERENTIAL THERMAL ANALYSIS; INTERNAL FRICTION; LIQUID METALS; RAPID SOLIDIFICATION; SOLDERING ALLOYS; SPECIFIC HEAT; THERMAL DIFFUSION IN SOLIDS; THERMAL EFFECTS; VIBRATIONS (MECHANICAL);

LEAD FREE SOLDER ALLOYS; LIQUIDUS TEMPERATURE; MOLTEN STATE; SOLIDUS TEMPERATURE; VIBRATION RESONANCE TECHNIQUE;

TIN ALLOYS;

EID: 19444370708     PISSN: 09574522     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10854-005-0763-4     Document Type: Article

References (9)

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