Molecular dynamics simulations of thermal effects in nanometric cutting process

Science China Technological Sciences

Volumn 53, Issue 3, 2010, Pages 870-874

  Guo, YongBo ^a   Liang, YingChun ^a   Chen, MingJun ^a   Bai, QingShun ^a   Lu, LiHua ^a  

^a HARBIN INSTITUTE OF TECHNOLOGY   (China)

Author keywords

Molecular dynamics; Nanometric cutting; Temperature distribution

Indexed keywords

CUTTING; MORSE POTENTIAL; NANOCRYSTALLINE MATERIALS; TEMPERATURE DISTRIBUTION;

HIGH TEMPERATURE; HIGHEST TEMPERATURE; MACHINED SURFACE; MATERIAL REMOVING; MOLECULAR DYNAMICS SIMULATIONS; NANO-METRIC CUTTINGS; STEEP TEMPERATURE GRADIENT; TERSOFF POTENTIAL;

MOLECULAR DYNAMICS;

EID: 77950819150     PISSN: 16747321     EISSN: 18691900     Source Type: Journal    
DOI: 10.1007/s11431-009-0243-9     Document Type: Article

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