A study on mechanism of nano-cutting single crystal silicon

Journal of Materials Processing Technology

Volumn 184, Issue 1-3, 2007, Pages 407-410

  Fang, F Z ^a   Wu, H ^b   Zhou, W ^c   Hu, X T ^a  

^a TIANJIN UNIVERSITY   (China)

^b SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^c NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Nano cutting; Silicon; TEM

Indexed keywords

CRACKS; CUTTING; EXTRUSION; NANOTECHNOLOGY; SINGLE CRYSTALS; TRANSMISSION ELECTRON MICROSCOPY;

AMORPHOUS STRUCTURE; DUCTILE MODE; NANOCUTTING;

SILICON;

EID: 33846816548     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jmatprotec.2006.12.007     Document Type: Article

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