Experimental analysis and finite element modelling of nano-scratch test applied on 40-120 nm SiCN thin films deposited on Cu/Si substrate

Thin Solid Films

Volumn 518, Issue 14, 2010, Pages 3859-3865

  Roy, S ^a,b   Darque Ceretti, E ^a   Felder, E ^a   Raynal, F ^b   Bispo, I ^b  

^a PSL RESEARCH UNIVERSITY   (France)

^b Alchimer   (France)

Author keywords

Adhesion; Copper; Finite element modelling; Nano scratch; SiCN; Thin films

Indexed keywords

CRITICAL LOAD; EXPERIMENTAL ANALYSIS; FINITE ELEMENT MODELLING; INTERFACIAL ADHESIONS; INTERFACIAL TENSILE STRESS; LINEAR DEPENDENCE; NANO-SCRATCH; PLASMA ENHANCED CHEMICAL VAPOUR DEPOSITION; SICN; THREE DIMENSIONAL FINITE ELEMENT MODEL;

ADHESION; AMORPHOUS FILMS; DEPOSITION; PLASMA DEPOSITION; SUBSTRATES; THIN FILMS; THREE DIMENSIONAL;

FINITE ELEMENT METHOD;

EID: 77950629078     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.02.004     Document Type: Article

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