The stress reduction effect by interlayer deposition or film thickness for diamond like carbon on rough surface

Diamond and Related Materials

Volumn 19, Issue 5-6, 2010, Pages 518-524

  Wei, Chehung ^a   Yang, Jui Feng ^a   Tai, Fong Cheng ^b  

^a TATUNG UNIVERSITY   (Taiwan)

^b NATIONAL TSING HUA UNIVERSITY   (Taiwan)

Author keywords

Film thickness; Finite element; Interlayer; Stress reduction

Indexed keywords

COEFFICIENT OF THERMAL EXPANSION; DIAMOND LIKE CARBON; FINITE ELEMENT; FINITE ELEMENT ANALYSIS; INTERLAYER; METALLIC INTERLAYER; ROUGH SURFACES; STRESS REDUCTION; THERMAL COOLING;

CARBON FILMS; DIAMOND LIKE CARBON FILMS; FINITE ELEMENT METHOD; MAGNETIC FILMS; SURFACE MEASUREMENT; THERMAL STRESS; THERMOELASTICITY;

THERMAL EXPANSION;

EID: 77950367441     PISSN: 09259635     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.diamond.2010.01.015     Document Type: Article

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