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Volumn 17, Issue 7-10, 2008, Pages 1534-1540
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The effect of thermal and plastic mismatch on stress distribution in diamond like carbon film under different interlayer/substrate system
a
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Author keywords
Interlayer; Plastic mismatch; Thermal mismatch
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Indexed keywords
ADHESION;
CARBIDES;
CARBON;
CARBON FILMS;
CHROMIUM;
CRACKING (CHEMICAL);
DIAMOND FILMS;
DIAMOND LIKE CARBON FILMS;
DIAMONDS;
ELECTRIC LOAD MANAGEMENT;
FILM GROWTH;
FINITE ELEMENT METHOD;
MECHANICAL PROPERTIES;
METALS;
PHOTOMASKS;
PLASTICS;
STRENGTH OF MATERIALS;
STRESS CONCENTRATION;
STRESSES;
SUBSTRATES;
THERMAL SPRAYING;
THERMAL STRESS;
THERMOELASTICITY;
YIELD STRESS;
CARBIDE FORMATION;
COEFFICIENT OF EXPANSION;
COEFFICIENT OF THERMAL EXPANSION;
COEFFICIENTS OF THERMAL EXPANSIONS;
CRACK GROWTH;
DEPOSITION PROCESSING;
DIAMOND-LIKE CARBON;
DIFFERENT SUBSTRATES;
FINITE-ELEMENT PROGRAMS;
HIGH STRESS;
INDENTATION PROCESS;
INTERLAYER;
PLASTIC MISMATCH;
POOR ADHESION;
STEEL SUBSTRATES;
STRESS DISTRIBUTIONS;
SUBSTRATE EFFECTS;
THERMAL MISMATCH;
YOUNG'S MODULUS;
THERMAL EXPANSION;
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EID: 48849097323
PISSN: 09259635
EISSN: None
Source Type: Journal
DOI: 10.1016/j.diamond.2008.03.004 Document Type: Article |
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Times cited : (47)
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References (19)
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