Effect of packaging on dielectric charging in RF MEMS capacitive switches

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 1637-1640

  Peng, Zhen ^a   Palego, Cristiano ^a   Hwang, James C M ^a   Moody, Cody ^b   Malczewski, Andrew ^b   Pillans, Brandon W ^b   Forehand, David I ^c   Goldsmith, Charles L ^c  

^a LEHIGH UNIVERSITY   (United States)

^b RAYTHEON COMPANY   (United States)

^c MEMtronics Inc   (United States)

Author keywords

Charge injection; Dielectric films; Dielectric materials; Humidity; Microelectromechanical devices; Microwave devices; Packaging; Switches

Indexed keywords

AMBIENT ATMOSPHERE; DIELECTRIC CHARGING; DIELECTRIC SURFACE; HERMETIC PACKAGES; HUMIDITY; LONG LIFETIME; MINIMUM SURFACES; NOVEL TECHNIQUES; PACKAGING PROCESS; RF MEMS CAPACITIVE SWITCHES; SURFACE CHARGING;

DIELECTRIC DEVICES; DIELECTRIC FILMS; ELECTRIC SWITCHES; ELECTROSTATIC ACTUATORS; INSULATING MATERIALS; MEMS; MICROWAVE DEVICES; MICROWAVES; MOISTURE; PACKAGING; PACKAGING MATERIALS; SURFACES;

MICROELECTROMECHANICAL DEVICES;

EID: 77949946306     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5166027     Document Type: Conference Paper

References (6)

1. C. L. Goldsmith, D. I. Forehand, Z. Peng, J. C. M. Hwang, and J. L. Ebel, "High-cycle life testing of RF MEMS switches," IEEE MTT-S Int. Microwave Symp. Dig., pp. 1805-1808, June 2007.
2. Z. Peng, C. Palego, J. C. M. Hwang, D. I. Forehand, C. L. Goldsmith, C. Moody, A. Malczewski, B. W. Pillans, R. Daigler, and J. Papapolymerou, "Impact of humidity on dielectric charging in RF MEMS capacitive switches," IEEE Microwave Wireless Components Lett., accepted for publication.
3. Z. Peng, X. Yuan, J. C. M. Hwang, D. Forehand, and C. L. Goldsmith, "Top vs. bottom charging of dielectric in RF MEMS capacitive switches," Proc. Asia Pacific Microwave Conf., Dec. 2006.
4. B. Pillans, L. Coryell, A. Malczewski, C. Moody, F. Morris, and V. Pillai, "RF MEMS phase shifters manufacturing technology," Proc. Defense Manufacturing Conf., Dec. 2008.
5. D.I. Forehand and C.L. Goldsmith, "Zero-level packaging for RF MEMS Switches," Proc. Government Microcircuit Applications Critical Technologies Conf., pp. 36-39, Mar. 2006.
6. C. Moody, B. Pillans, A. Malczewski, and F. Morris, "Near hermetic wafer level packaging using LCP adhesive layer," Proc. IMAPS Int. Conf. Device Packaging, Mar. 2009.