메뉴 건너뛰기




Volumn 3, Issue , 2008, Pages 1405-1420

Near hermetic wafer level packaging using LCP adhesive layer

Author keywords

[No Author keywords available]

Indexed keywords


EID: 84877726956     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (3)

References (6)
  • 4
    • 0032142144 scopus 로고    scopus 로고
    • Performance of low-loss RF MEMS capacitive switches microwave and guided wave letters
    • IEEE Aug.
    • Goldsmith, C.L.; Zhimin Yao; Eshelman, S.; Denniston, D.; Performance of low-loss RF MEMS capacitive switches Microwave and Guided Wave Letters, IEEE [see also IEEE Microwave and Wireless Components Letters] Volume 8, Issue 8, Aug. 1998 Page(s):269 - 271
    • (1998) IEEE Microwave and Wireless Components Letters , vol.8 , Issue.8 , pp. 269-271
    • Goldsmith, C.L.1    Yao, Z.2    Eshelman, S.3    Denniston, D.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.