-
1
-
-
0031306311
-
Compact fiber-coupled high-power diode laser unit
-
M. Baumann, B. Ehlers, M. Quade, K. Du, H.-G. Treusch, P. Loosen, and R. Poprawe, "Compact fiber-coupled high-power diode laser unit," in Proc. Int. Soc. Opt. Eng., vol.3097. 1997, pp. 712-716.
-
(1997)
Proc. Int. Soc. Opt. Eng.
, vol.3097
, pp. 712-716
-
-
Baumann, M.1
Ehlers, B.2
Quade, M.3
Du, K.4
Treusch, H.-G.5
Loosen, P.6
Poprawe, R.7
-
2
-
-
0031350206
-
Micro-optical beam transformation system for high-power laser diode bars with efficient brightness conservation
-
R. G̈oring, P. Schreiber, and T. Possner, "Micro-optical beam transformation system for high-power laser diode bars with efficient brightness conservation," in Proc. Int. Soc. Opt. Eng., vol.3008. 1997, pp. 202-210.
-
(1997)
Proc. Int. Soc. Opt. Eng.
, vol.3008
, pp. 202-210
-
-
G̈oring, R.1
Schreiber, P.2
Possner, T.3
-
3
-
-
3543069408
-
Highefficiency high-power 808-nm laser array and stacked arrays optimized for elevated temperature operation
-
P. A. Crump, T. R. Crum, M. A. DeVito, J. Farmer, M. Grimshaw, Z. Huang, S. A. Igl, S. Macober, P. Thiagarajan, and D. Wise, "Highefficiency high-power 808-nm laser array and stacked arrays optimized for elevated temperature operation," in Proc. Int. Soc. Opt. Eng., vol.5336. 2004, pp. 144-155.
-
(2004)
Proc. Int. Soc. Opt. Eng.
, vol.5336
, pp. 144-155
-
-
Crump, P.A.1
Crum, T.R.2
Devito, M.A.3
Farmer, J.4
Grimshaw, M.5
Huang, Z.6
Igl, S.A.7
MacOber, S.8
Thiagarajan, P.9
Wise, D.10
-
4
-
-
77949567291
-
-
German Patent DE 19821544A1, Dec.16
-
D. Lorenzen, F. Daiminger, F. Dorsch, and K. Süß, "Diodenlaserbauelement und Verfahren zu dessen Herstellung," German Patent DE 19821544A1, Dec. 16, 1999.
-
(1999)
Diodenlaserbauelement und Verfahren zu Dessen Herstellung
-
-
Lorenzen, D.1
Daiminger, F.2
Dorsch, F.3
Süß, K.4
-
6
-
-
34247374299
-
Next generation of cooling approaches for diode laser bars
-
M. Leers, K. Boucke, C. Scholz, and T. Westphalen, "Next generation of cooling approaches for diode laser bars," in Proc. Int. Soc. Opt. Eng., vol.6456. 2007, pp. 64561A-1-64561A-10.
-
(2007)
Proc. Int. Soc. Opt. Eng.
, vol.6456
-
-
Leers, M.1
Boucke, K.2
Scholz, C.3
Westphalen, T.4
-
7
-
-
77949568049
-
-
German Patent DE 195 06 093 C2, Dec.
-
C. Ullmann, "Diodenlaserbauelement," German Patent DE 195 06 093 C2, Dec. 7, 2000.
-
(2000)
Diodenlaserbauelement
, pp. 7
-
-
Ullmann, C.1
-
8
-
-
34247342127
-
Scalable high power (>1 kW/cm2) diode laser stacks based on silicon monolithic micro-channel coolers
-
P. Reichert, M. Fouksman, H. Zhou, D. Nabors, J. Alcala, S. Tolman, M. Toivonen, S. Lehkonen, and J. Haapamaa, "Scalable high power (>1 kW/cm2) diode laser stacks based on silicon monolithic micro-channel coolers," in Proc. Int. Soc. Opt. Eng., vol.6456. 2007, pp. 64560I- 1-64560I-11.
-
(2007)
Proc. Int. Soc. Opt. Eng.
, vol.6456
-
-
Reichert, P.1
Fouksman, M.2
Zhou, H.3
Nabors, D.4
Alcala, J.5
Tolman, S.6
Toivonen, M.7
Lehkonen, S.8
Haapamaa, J.9
-
9
-
-
0027589460
-
High-duty cycle, high power two-dimensional laser diode arrays
-
G. L. Harnagel, M. Vakili, K. R. Anderson, D. P. Worland, J. G. Endriz, and D. R. Scifres, "High-duty cycle, high power two-dimensional laser diode arrays," Electron. Lett., vol.29, no.11, pp. 1008-1010, 1993.
-
(1993)
Electron. Lett.
, vol.29
, Issue.11
, pp. 1008-1010
-
-
Harnagel, G.L.1
Vakili, M.2
Anderson, K.R.3
Worland, D.P.4
Endriz, J.G.5
Scifres, D.R.6
-
11
-
-
77949566663
-
-
U.S. Patent 5 923 692, Jul.
-
M. P. Staskus, J. M. Haden, and J. G. Endriz, "No wire bond plate packaging architecture for two dimensional stacked diode laser arrays," U.S. Patent 5 923 692, Jul. 13, 1999.
-
(1999)
No Wire Bond Plate Packaging Architecture for Two Dimensional Stacked Diode Laser Arrays
, pp. 13
-
-
Staskus, M.P.1
Haden, J.M.2
Endriz, J.G.3
-
12
-
-
77949569758
-
-
U.S. Patent 6 424 667 B1, Jul.
-
J. G. Endriz, J. Chan, E. L. Wolak, and G. R. Dohle, "Solder and material designs to improve resistance to cycling fatigue in laser diode stacks," U.S. Patent 6 424 667 B1, Jul. 23, 2002.
-
(2002)
Solder and Material Designs to Improve Resistance to Cycling Fatigue in Laser Diode Stacks
, pp. 23
-
-
Endriz, J.G.1
Chan, J.2
Wolak, E.L.3
Dohle, G.R.4
-
13
-
-
77949567893
-
-
U.S. Patent 6 700 913 B2, Mar.
-
G. G. Pinneo, M. D. Grgas, and K. A. Bennett, "Low cost high integrity diode laser array," U.S. Patent 6 700 913 B2, Mar. 2, 2004.
-
(2004)
Low Cost High Integrity Diode Laser Array
, pp. 2
-
-
Pinneo, G.G.1
Grgas, M.D.2
Bennett, K.A.3
-
14
-
-
34247391896
-
Highly reliable hard soldered QCW laser diode stack packaging platform
-
P. Rosenberg, P. Reichert, J. Du, M. Fouksman, H. Zhou, J. McNulty, S. Tolman, and C. Luong, "Highly reliable hard soldered QCW laser diode stack packaging platform," in Proc. Int. Soc. Opt. Eng., vol.6456. 2007, pp. 645618-1-645618-10.
-
(2007)
Proc. Int. Soc. Opt. Eng.
, vol.6456
, pp. 6456181-64561810
-
-
Rosenberg, P.1
Reichert, P.2
Du, J.3
Fouksman, M.4
Zhou, H.5
McNulty, J.6
Tolman, S.7
Luong, C.8
-
15
-
-
51349110217
-
Highly stable conductively cooled 1 kW-QCW diode laser stacks with high duty cycle
-
W. Pittroff, G. Erbert, B. Eppich, C. Fiebig, K. Vogel, and G. Traenkle, "Highly stable conductively cooled 1 kW-QCW diode laser stacks with high duty cycle," in Proc. Electron. Compon. Technol. Conf., 2008, pp. 991-997.
-
(2008)
Proc. Electron. Compon. Technol. Conf.
, pp. 991-997
-
-
Pittroff, W.1
Erbert, G.2
Eppich, B.3
Fiebig, C.4
Vogel, K.5
Traenkle, G.6
-
16
-
-
34247386715
-
High-power, high brightness 100 W QCW diode laser at 940 nm
-
C. Fiebig, G. Erbert, W. Pittroff, H. Wenzel, A. Maasdorf, S. Einfeldt, and G. Tränkle, "High-power, high brightness 100 W QCW diode laser at 940 nm," in Proc. Int. Soc. Opt. Eng., vol.6456. 2007, pp. 64560K- 1-64560K-8.
-
(2007)
Proc. Int. Soc. Opt. Eng.
, vol.6456
-
-
Fiebig, C.1
Erbert, G.2
Pittroff, W.3
Wenzel, H.4
Maasdorf, A.5
Einfeldt, S.6
Tr̈ankle, G.7
-
17
-
-
44949105326
-
Stable and compact mounting scheme for > 1 kW QCW diode laser stacks at 940 nm
-
C. Fiebig, G. Eppich, W. Pittroff, and G. Erbert, "Stable and compact mounting scheme for > 1 kW QCW diode laser stacks at 940 nm," in Proc. Int. Soc. Opt. Eng. Photonics West, vol.6876. 2008, pp. 68760J- 1-68760J-10.
-
(2008)
Proc. Int. Soc. Opt. Eng. Photonics West
, vol.6876
-
-
Fiebig, C.1
Eppich, G.2
Pittroff, W.3
Erbert, G.4
-
18
-
-
0026170160
-
A new bonding technology using gold and tin multilayer composite structures
-
C. C. Lee, C. Y. Wang, and G. S. Matijasevic, "A new bonding technology using gold and tin multilayer composite structures," IEEE Trans. Compon. Hybrids Manuf. Technol., vol.14, no.2, pp. 407-412, 1991.
-
(1991)
IEEE Trans. Compon. Hybrids Manuf. Technol.
, vol.14
, Issue.2
, pp. 407-412
-
-
Lee, C.C.1
Wang, C.Y.2
Matijasevic, G.S.3
-
19
-
-
0030106551
-
Mounting of high power laser diodes on diamond heatsinks
-
S. Weiß, E. Zakel, and H. Reichl, "Mounting of high power laser diodes on diamond heatsinks," IEEE Trans. Compon. Packag. Manuf. Technol. A, vol.10, no.1, pp. 46-53, 1996.
-
(1996)
IEEE Trans. Compon. Packag. Manuf. Technol. A
, vol.10
, Issue.1
, pp. 46-53
-
-
Weiß, S.1
Zakel, E.2
Reichl, H.3
-
20
-
-
0035521195
-
Mounting of high power laser diodes on boron nitride heat sinks using an optimized AuSn metallurgy
-
Nov.
-
W. Pittroff, G. Erbert, G. Beister, F. Bugge, A. Klein, A. Knauer, J. Maege, P. Ressel, J. Sebastian, R. Staske, and G. Tränkle, "Mounting of high power laser diodes on boron nitride heat sinks using an optimized AuSn metallurgy," IEEE Trans. Adv. Packag., vol.24, no.4, pp. 434- 441, Nov. 2001.
-
(2001)
IEEE Trans. Adv. Packag.
, vol.24
, Issue.4
, pp. 434-441
-
-
Pittroff, W.1
Erbert, G.2
Beister, G.3
Bugge, F.4
Klein, A.5
Knauer, A.6
Maege, J.7
Ressel, P.8
Sebastian, J.9
Staske, R.10
Tr̈ankle, G.11
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