Next generation of cooling approaches for diode laser bars

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6456, Issue , 2007, Pages

  Leers, Michael ^a   Boucke, Konstantin ^a   Scholz, Christian ^a   Westphalen, Thomas ^a  

^a FRAUNHOFER INSTITUTE FOR LASER TECHNOLOGY   (Germany)

Author keywords

CFD simulation; Conductively cooled heat sinks; Particle image velocimetry (PIV); Thermal and mechanical simulation

Indexed keywords

COOLING; ELECTRONICS PACKAGING; HEAT RESISTANCE; HEAT SINKS; MICROCHANNELS; SEMICONDUCTOR LASERS; WAVELENGTH;

CONDUCTIVELY COOLED HEAT SINKS; PARTICLE IMAGE VELOCIMETRY (PIV); THERMAL AND MECHANICAL SIMULATION;

BARS (METAL);

EID: 34247374299     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.701896     Document Type: Conference Paper

References (3)

1. Leers, M. et al, "Expansion-matched passivley cooled heat sinks with low thermal resistance for high-power diode laser bars", Proceedings of SPIE, Volume 6104 pp. 20-29, 2006.
2. Westphalen, T. "Untersuchungen von Hochleistungs-Diodenlaserbarren mittels Einzelemitter aufgelöster Charakterisierung", Diploma thesis at the chair of TOS RWTH-Aachen, 2006
3. Tomm, J. "Quantum-Well Laser Array Packaging", McGraw-Hill Professional, 2006