Mounting of high power laser diodes on diamond heatsinks

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 19, Issue 1, 1996, Pages 46-53

  Weiß, Stefan ^a,b   Zakel, Elke ^a,c   Reichl, Herbert ^a,b  

^a IEEE

^b TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^c FRAUNHOFER IZM   (Germany)

Author keywords

Au(80)Sn(20); Diamond heatsink; Die bonding; Fluxless; High power laser diode

Indexed keywords

AGING OF MATERIALS; CHEMICAL VAPOR DEPOSITION; DIAMONDS; HEAT SINKS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; METALLIZING; SCANNING ELECTRON MICROSCOPY; SHEAR STRESS; SOLDERING; STRESS ANALYSIS;

DIE BONDING; ENERGY DISPERSIVE X RAY ANALYSIS; PEEL STRESS; TENSILE STRESS;

SEMICONDUCTOR LASERS;

EID: 0030106551     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.486562     Document Type: Article

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