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Volumn 44, Issue 9-11 SPEC. ISS., 2004, Pages 1425-1430

Partial discharge failure analysis of AlN substrates for IGBT modules

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM NITRIDE; CERAMIC MATERIALS; FAILURE ANALYSIS; HEAT SINKS; MICROPROCESSOR CHIPS; PARTIAL DISCHARGES; SILICON; VIDEO CAMERAS;

EID: 4544307772     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2004.07.111     Document Type: Conference Paper
Times cited : (36)

References (6)
  • 4
    • 0036245360 scopus 로고    scopus 로고
    • Localization of electrical-insulation- and Partial-Discharge failures of IGBT modules
    • Mitic G, Lefranc G. Localization of electrical-insulation- and Partial-Discharge failures of IGBT modules. IEEE Transactions on Industry Applications 2002; 38 (1): 175-178.
    • (2002) IEEE Transactions on Industry Applications , vol.38 , Issue.1 , pp. 175-178
    • Mitic, G.1    Lefranc, G.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.