|
|
|
Volumn , Issue , 1998, Pages 565-568
|
|
Partial discharge behaviour of power electronic packaging insulation
|
|
Author keywords
[No Author keywords available]
|
|
Indexed keywords
BIPOLAR TRANSISTORS;
BUBBLES (IN FLUIDS);
CERAMIC MATERIALS;
COPPER;
DELAMINATION;
ELECTRONICS PACKAGING;
GATES (TRANSISTOR);
HEAT SINKS;
INTERFACES (MATERIALS);
METALLIZING;
PARTIAL DISCHARGES;
POWER ELECTRONICS;
INSULATED GATE BIPOLAR TRANSISTORS (IGBT);
SILICON GEL;
ELECTRIC INSULATING MATERIALS;
|
|
EID: 0032315669
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
|
Times cited : (26)
|
|
References (2)
|
