Recent advances in the development of no-flow underfill encapsulants - A practical approach towards the actual manufacturing application

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 22, Issue 4, 1999, Pages 252-

  Shi, Songhua ^a   Wong, C P ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

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EID: 33748029787     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

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