An energy-based failure criterion for delamination initiation in electronic packaging

Journal of Adhesion Science and Technology

Volumn 19, Issue 15, 2005, Pages 1375-1386

  Fan, Hai B O ^a   Chung, Paular W K ^a   Yuen, Matthew M F ^a   Chan, Philip C H ^a  

^a HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Hong Kong)

Author keywords

Button shear test; Delamination; Failure criterion; Finite element method

Indexed keywords

ADHESION; COMPUTER SIMULATION; DELAMINATION; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); PROBLEM SOLVING; SHEAR STRESS; COPPER; CRACKS; STRAIN MEASUREMENT; WELDS;

BUTTON SHEAR TEST; FAILURE CRITERION; INTERFACIAL HYDROSTATIC STRAIN ENERGY; STRAIN ENERGY DENSITY;

ELECTRONICS PACKAGING;

BUTTON SHEAR TESTS; DELAMINATION INITIATION; ELECTRONIC PACKAGE; ELECTRONIC PACKAGING; EPOXY MOLDING COMPOUNDS; FAILURE CRITERIA; FAILURE CRITERION; FAILURE LOAD; FAILURE MECHANISM; FAILURE PARAMETERS; FINITE ELEMENT; FINITE ELEMENT MODELS; FRACTURE CRITERIA; HYDROSTATIC STRAIN; INTERFACIAL ADHESIONS; INTERFACIAL DELAMINATION; INTERFACIAL STRAIN; LEAD-FRAME; PRE-CRACKS; SHEAR ANGLES; STRAIN ENERGY DENSITY; TENSILE MODE;

EID: 29344456371     PISSN: 01694243     EISSN: None     Source Type: Journal    
DOI: 10.1163/156856105774784349     Document Type: Article

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