A versatile design of solid immersion lenses in bulk silicon using focused ion beam techniques

Conference Proceedings from the International Symposium for Testing and Failure Analysis

Volumn , Issue , 2009, Pages 119-125

  Scholz, P ^a   Kerst, U ^a   Boit, C ^a   Tsao, C C ^b,c   Lundquist, T ^b  

^a TECHNISCHE UNIVERSITÄT BERLIN   (Germany)

^b DCG SYSTEMS INC   (United States)

^c Solyndra Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANTI REFLECTIVE COATINGS; BULK SILICON; FOCUSED ION BEAM TECHNIQUE; INTERFERENCE RINGS; MILLING PROCESS; PHOTON EMISSION MICROSCOPY; PLANAR SHAPE; PROCESSING TIME; SAMPLE THICKNESS; SOLID IMMERSION LENS;

FOCUSED ION BEAMS; LENSES; MILLING (MACHINING); OPTICAL DATA STORAGE; OPTICAL INSTRUMENTS; QUALITY ASSURANCE; REFLECTIVE COATINGS; SAFETY FACTOR;

FAILURE ANALYSIS;

EID: 77649111682     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. P. Scholz et al., "Creation of Solid Immersion Lenses in Bulk Silicon Using Focused Ion Beam Backside Editing Techniques", Proc. 34th ISTFA, 2008, pp. 157-62
2. F. Zachariasse, M. Goossens, "Diffractive lenses for high resolution laser based failure analysis", Proc. 31st ISTFA, 2005, pp. 1-7
3. H.-G. Wagemann, Grundlagen der optoelektronischen Halbleiterbauelemente, B. G. Teubner (Stuttgart 1998), p. 228
4. E. Hecht, Optics, Addison-Wesley (2nd Ed., 1974), p. 134. p. 144, p. 507
5. C. Boit, "Fundamentals of Photon Emission (PEM) in Silicon - Electroluminescence for Analysis of Electronic Circuit and Device Functionality", Microelectronics Failure Analysis Desk Reference 5th Edition, 2004, pp. 356-368
6. R. K. Jain et al., "Advanced Fringe Analysis Techniques in Circuit Edit", Proc. 32nd ISTFA, 2006, pp. 79-85
7. J. Aguilar e7t al., "Optical mismatch in double AR coated c-Si, a simple theoretical and experimental correlation", 3rd World Conference on Photovoltaic Energy Conversion, 2003, pp. 1001-1004