Investigation of interfacial thermal resistance of bi-layer nanofilms by nonequilibrium molecular dynamics

Journal of Physics D: Applied Physics

Volumn 43, Issue 8, 2010, Pages

  Ju, Shenghong ^a   Liang, Xingang ^a,b   Wang, Shuaichuang ^a  

^a TSINGHUA UNIVERSITY   (China)

^b INSTITUTE OF APPLIED PHYSICS AND COMPUTATIONAL MATHEMATICS   (China)

Author keywords

[No Author keywords available]

Indexed keywords

BI-LAYER; FILM MATERIALS; FREQUENCY DISTRIBUTIONS; INTERFACIAL RESISTANCES; INTERFACIAL TEMPERATURE; INTERFACIAL THERMAL RESISTANCE; LAYER THICKNESS; NANO FILMS; NONEQUILIBRIUM MOLECULAR DYNAMICS; NONEQUILIBRIUM MOLECULAR DYNAMICS SIMULATION; PHONON DENSITY OF STATE;

HEAT FLUX; MAGNETIC FILMS; MOLECULAR DYNAMICS;

HEAT RESISTANCE;

EID: 77149157798     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/43/8/085407     Document Type: Article

References (38)

1. Blazej D 2003 Electron. Cool. 9 14
2. Xu Y B, Goto M, Tanaka Y, Tanaka M, Shimono M and Yamazaki M 2008 High Temp.-High Pressures 37 31
3. Wang S C and Liang X G 2008 Int. J. Thermophys. submitted
4. Hu C, Kiene M and Ho P S 2001 Appl. Phys. Lett. 79 4121
5. Khalatnikov I M 1952 Zh. Eksp. Teor. Fiz. 22 687
6. Swartz E T and Pohl R O 1989 Rev. Mod. Phys. 61 605
7. Lee S M and Cahill D G 1997 J. Appl. Phys. 81 2590
8. Kato R and Hatta I 2008 Int. J. Thermophys. 29 2062
9. Schelling P K, Phillpot S R and Keblinski P 2002 Appl. Phys. Lett. 80 2484
10. Hu M, Keblinski P and Schelling P K 2009 Phys. Rev. B 79 104305
11. Zhong H L and Lukes J R 2006 Phys. Rev. B 74 125403
12. Hu M, Keblinski P, Wang J S and Raravikar N 2008 J. Appl. Phys. 104 083503
13. Patel H A, Gardes S and Keblinski P 2005 Nano Lett. 5 2225
14. Wang C S, Chen J S, Shiomi J and Maruyama S 2007 Int. J. Therm. Sci. 46 1203
15. Abramson A R, Tien C L and Majumdar A 2002 J. Heat Transfer 124 963
16. Liang X G and Sun L 2005 Microscale Thermophys. Eng. 9 295
17. Rapaport D C 2004 The Art of Molecular Dynamics Simulation 2nd edn (Cambridge: Cambridge University Press) pp 11-43
18. Hoover W G 1985 Phys. Rev. A 31 1695
19. Stevens R J, Zhigilei L V and Norris P M 2007 Int. J. Heat Mass Transfer 50 3977
20. Kapitza P L 1941 J. Phys. (USSR) 4 181
21. Little W A 1959 Can. J. Phys. 37 334
22. Xu Y, Kang J W, Huang T Y and Hu Y Y 2008 Tsinghua Sci. Technol. 13 132
23. Keune W and Sturhahn W 1999 Hyperfine Interact. 123-124 847
24. Hasselman D P H, Donaldson K Y, Barlow F D, Elshabini A A, Schiroky G H, Yaskoff J P and Dietz R L 2000 IEEE Trans. Component Packaging Technol. 23 633
25. Hu M, Keblinski P and Li B W 2008 Appl. Phys. Lett. 92 211908
26. Wu G and Li B W 2008 J. Phys.: Condens. Matter 20 175211
27. Wu G and Li B W 2007 Phys. Rev. B 76 085424
28. Ruokola T, Ojanen T and Jauho A P 2009 Phys. Rev. B 79 144306
29. Liang X G 2007 Chin. Sci. Bull. 52 2457
30. Liang X G, Sun L and Shi B 2002 Proc. 12th Int. Heat Transfer Conf. (Grenoble, France) pp 567-72
31. Li B W, Wang L and Casati G 2004 Phys. Rev. Lett. 93 184301
32. Li B W, Lan J H and Wang L 2005 Phys. Rev. Lett. 95 104302
33. Lan J H and Li B W 2006 Phys. Rev. B 74 214305
34. Hu B, Yang L and Zhang Y 2006 Phys. Rev. Lett. 97 124302
35. Chang C W, Okawa D, Majumdar A and Zettl A 2006 Science 314 1121
36. Keeler G J and Batchelder D N 1970 J. Phys. C: Solid State Phys. 3 510
37. Dobbs E R, Figgins B F and Jones G O 1958 Il Nuovo Cimento 9 32
38. Cheeke J D, Ettinger H and Hebral B 1976 Can. J. Phys. 54 1749