Low cost camera modules using integration of wafer-scale optics and wafer-level packaging of image sensors

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 7631, Issue , 2009, Pages

  Han, Hongtao ^a   Main, Keith ^a  

^a Tessera Inc   (United States)

Author keywords

Low cost camera; Wafer bonding; Wafer level camera; Wafer level optics; Wafer level packaging; Wafer scale integration; Wafer scale optics; WLCSP

Indexed keywords

LOW COST CAMERA; LOW COSTS; WAFER LEVEL; WAFER LEVEL CAMERA; WAFER LEVEL OPTICS; WAFER LEVEL PACKAGING; WAFER SCALE; WAFER SCALE INTEGRATION; WAFER SCALE OPTICS;

APPROXIMATION THEORY; CAMERAS; COSTS; DIGITAL DEVICES; DIGITAL IMAGE STORAGE; IMAGE SENSORS; LEAD; MEDICAL APPLICATIONS; OPTOELECTRONIC DEVICES; PACKAGING; SOLDERING ALLOYS; WAFER BONDING;

ELECTRONICS PACKAGING;

EID: 77049099631     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.852776     Document Type: Conference Paper

References (6)

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