Ultra-high density MEMS probe memory device

Microelectronic Engineering

Volumn 87, Issue 5-8, 2010, Pages 1198-1203

  Heck, John ^a   Adams, Donald ^b   Belov, Nickolai ^b   Chou, Tsung Kuan A ^a   Kim, Byong ^b   Kornelsen, Kevin ^c   Ma, Qing ^a   Rao, Valluri ^a   Severi, Simone ^d   Spicer, Dean ^c   Tchelepi, Ghassan ^b   Witvrouw, Ann ^d  

^a INTEL CORPORATION   (United States)

^b Nanochip Inc   (United States)

^c Micralyne Inc   (Canada)

^d IMEC   (Belgium)

Author keywords

AuSn bonding; Bulk micromachining; Cantilever; CMOS MEMS integration; Microelectromechanical systems (MEMS); Poly SiGe; Probe storage; Surface micromachining; Wafer bonding

Indexed keywords

BULK- MICROMACHINING; CANTILEVER; CMOS-MEMS; MICROELECTROMECHANICAL SYSTEMS; POLY-SIGE; PROBE STORAGE;

ATOMIC FORCE MICROSCOPY; COMPOSITE MICROMECHANICS; MECHATRONICS; MEMS; MICROELECTROMECHANICAL DEVICES; NANOCANTILEVERS; POLYSILICON; PROBES; SEMICONDUCTING SILICON COMPOUNDS; SILICON ALLOYS; SURFACE MICROMACHINING; TIN ALLOYS;

WAFER BONDING;

EID: 76949085690     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.12.014     Document Type: Article

References (12)

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