Fabrication of Silicon on Diamond (SOD) substrates by either the Bonded and Etched-back SOI (BESOI) or the Smart-Cut™ technology

Solid-State Electronics

Volumn 54, Issue 2, 2010, Pages 158-163

  Widiez, J ^a   Rabarot, M ^a   Saada, S ^b   Mazellier, J P ^a   Dechamp, J ^a   Delaye, V ^a   Roussin, J C ^a   Andrieu, F ^a   Faynot, O ^a   Deleonibus, S ^a   Bergonzo, P ^b   Clavelier, L ^a  

^a CEA GRENOBLE   (France)

^b DIF   (France)

Author keywords

[No Author keywords available]

Indexed keywords

DIAMOND LAYERS; DIAMOND SURFACES; DIRECT BONDING PROCESS; HIGH-RESOLUTION TRANSMISSION MICROSCOPIES; INNOVATIVE PROCESS; MICROWAVE PLASMA; PLANARIZATION; POLYCRYSTALLINE DIAMONDS; SILICON CHANNEL; SILICON ON DIAMONDS; SMART-CUT;

MICROWAVES; PLASMA DEPOSITION; SUBSTRATES; SURFACE ROUGHNESS;

DIAMONDS;

EID: 76349116495     PISSN: 00381101     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sse.2009.12.012     Document Type: Article

References (12)

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