SOD wafer technology

Microelectronic Engineering

Volumn 66, Issue 1-4, 2003, Pages 510-516

  Gu, C Z ^a,b   Sun, Y ^a   Jia, J K ^a   Jin, Z S ^a  

^a INSTITUTE OF PHYSICS   (China)

^b JILIN UNIVERSITY   (China)

Author keywords

Diamond film; Integrated circuits; Irradiation hardness; Silicon on diamond

Indexed keywords

CHEMICAL VAPOR DEPOSITION; DIAMOND FILMS; INTERFACES (MATERIALS); ION BOMBARDMENT; POSITIVE IONS; TENSILE STRESS; THERMAL CONDUCTIVITY OF SOLIDS;

IRRADIATION HARDNESS;

SILICON WAFERS;

EID: 0037395032     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0167-9317(02)00928-0     Document Type: Conference Paper

References (6)

1. Gruen D.M., Golder I.B. MRS Bull. 9:1998;16.
2. Landstrass M.I., Fleetwood D.M. Appl. Phys. Lett. 56:1990;2316.
3. Gu C.Z., Jin Z.S., Lu X. Diamond Relat. Mater. 7:1998;753.
4. Jiang X., Klages C.-P. Diamond Relat. Mater. 2:1993;1112.
5. Schwarzbach D., Haubner R., Lux B. Diamond Relat. Mater. 3:1994;757.
6. Chhowalla M., Yin Y., Amaratunga G.A.J., McKenzie D.R., Frauenheim T. Appl. Phys. Lett. 69:1996;2344.