Optimization of thermal resistance of stacked micro-channel using genetic algorithms

International Journal of Numerical Methods for Heat and Fluid Flow

Volumn 15, Issue 1, 2005, Pages 27-42

  Jeevan, K ^a   Quadir, G A ^a   Seetharamu, K N ^a   Azid, I A ^a   Zainal, Z A ^a  

^a SCHOOL OF PHYSICS   (Malaysia)

Author keywords

Finite element analysis; Optimization techniques; Thermal resistance

Indexed keywords

FINITE ELEMENT METHOD; FRICTION; GENETIC ALGORITHMS; HEAT CONDUCTION; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; MATHEMATICAL MODELS; NUSSELT NUMBER; OPTIMIZATION; REYNOLDS NUMBER; SPECIFIC HEAT; THERMAL EFFECTS; TWO DIMENSIONAL;

FLUID VELOCITY; FRICTION FACTOR; MASS FLOW RATES; OPTIMIZATION TECHNIQUES;

HEAT RESISTANCE;

ALGORITHM;

EID: 13844254919     PISSN: 09615539     EISSN: None     Source Type: Journal    
DOI: 10.1108/09615530510571930     Document Type: Article

References (10)

1. Bagley, J.D. (1967), "The behavior of adaptive systems which employ genetic and correlation algorithms", Dissertation Abstracts International, Vol. 28 No. 12.
2. Cohen, A.B. and Iyenger, M. (2002), "Design and optimization of air cooled heat sinks for sustainable development", IEEE Transactions on Components and Packaging Technologies, Vol. 25 No. 4, pp. 584-91.
3. Lewis, R.W., Morgan, K., Thoma, H.R. and Seetharamu, K.N. (1996), The Finite Element Method in Heat Transfer Analysis, Wiley, New York, NY.
4. Phillips, R.J. (1990), "Micro-channel heat sinks", Advances in Thermal Modeling of Electronic Components, ASME, Vol. 2, Ch. 3, pp. 109-84.
5. Quadir, G.A, Mydin, A. and Seetharamu, K.N. (2001), "Analysis of microchannel heat exchangers using FEM", International Journal of Numerical Methods for Heat and Fluid Flow, Vol. 11 No. 1, pp. 59-75.
6. Segerlind, L.J. (1984), Applied Finite Element Methods, Wiley, New York, NY.
7. Tuckerman, D.B. and Pease, R.F.W. (1981), "High performance heat sinking for VLSI", IEEE Electron Device Let, Vol. EDL-2, pp. 126-9.
8. Wei, X.J. (2000), "Simulation and optimization of a piezo-compressor", MS thesis, Nanyang Technological University, Singapore.
9. Wei, X.J. and Joshi, Y. (2003), "Optimization study of stacked micro-channel heat sinks for microelectronic cooling", IEEE Transactions on Components and Packaging Technologies, Vol. 26 No. 1, pp. 55-61.
10. Wei, X.J. and Joshi, Y. (2000), "Stacked micro-channel heat sinks for liquid cooling of microelectronic components", Journal of Electronic Packaging-ASME, Vol. 126, pp. 60-6.