A thermo-viscoplastic constitutive model for FCC metals with application to OFHC copper

International Journal of Mechanical Sciences

Volumn 52, Issue 2, 2010, Pages 120-135

  Rusinek, A ^a   Rodriguez Martinez J A ^b   Arias, A ^b  

^a UNIVERSITÉ DE LORRAINE   (France)

^b UNIVERSIDAD CARLOS III DE MADRID   (Spain)

Author keywords

Constitutive relation; OFHC copper; Strain rate; Thermal activation; Viscous drag

Indexed keywords

ANALYTICAL PREDICTIONS; CONSTITUTIVE RELATIONS; DYNAMIC HARDNESS; EXPERIMENTAL DATA; FCC METALS; FLOW STRESS; MATERIAL BEHAVIOUR; OFHC COPPER; OXYGEN FREE HIGH CONDUCTIVITY COPPER; PHYSICAL ASPECTS; PHYSICALLY BASED; SHEAR TESTING; SHEET STEEL; TEMPERATURE DEPENDENCE; THERMAL ACTIVATION; THERMAL ACTIVATION PROCESS; THERMO-VISCOPLASTIC; VISCOUS DRAG;

CONSTITUTIVE MODELS; COPPER; DRAG; MARTENSITIC STAINLESS STEEL; OXYGEN; PLASTIC FLOW; STEEL SHEET; STEEL TESTING; VISCOPLASTICITY;

STRAIN RATE;

EID: 75449107398     PISSN: 00207403     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmecsci.2009.07.001     Document Type: Article

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