Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration

2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09

Volumn , Issue , 2009, Pages 113-116

  Xie, Jianyong ^a   Chung, Daehyun ^a   Swaminathan, Madhavan ^a   Mcallister, Michael ^b   Deutsch, Alina ^c   Jiang, Lijun ^c   Rubin, Barry J ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b IBM   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D SYSTEM INTEGRATION; ANALYSIS RESULTS; HOTSPOT TEMPERATURE; INTEGRATED SYSTEMS; IR DROP; PARAMETERIZED; POWER DELIVERY NETWORK; SEVERAL VARIABLES; STACKED DIE; STACKING ORDER; SYSTEM COMPONENTS; TEMPERATURE EFFECTS; THERMAL CHARACTERISTICS; THERMAL INTERFACE MATERIALS; THROUGH SILICON VIAS; UNDERFILL MATERIALS; VOLTAGE SOURCE;

CHIP SCALE PACKAGES; DIES; ELECTRIC POWER TRANSMISSION; INTEGRATED OPTICS; TECHNOLOGICAL FORECASTING; THERMAL INSULATING MATERIALS; THREE DIMENSIONAL;

CUSTOMER SATISFACTION;

EID: 74549131048     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEPS.2009.5338465     Document Type: Conference Paper

References (7)

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