Electrical-thermal co-analysis for power delivery networks in 3D system integration

2009 IEEE International Conference on 3D System Integration, 3DIC 2009

Volumn , Issue , 2009, Pages

  Xie, Jianyong ^a   Chung, Daehyun ^a   Swaminathan, Madhavan ^a   Mcallister, Michael ^b   Deutsch, Alina ^c   Jiang, Lijun ^c   Rubin, Barry J ^c  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b IBM   (United States)

^c IBM T J WATSON RESEARCH CENTER   (United States)

Author keywords

3D integration; Electrical thermal co anlysis; IR drop; Joule heating; Power delivery network (PDN); Temperature effect; Through silicon via (TSV)

Indexed keywords

3-D INTEGRATION; 3-D SYSTEM INTEGRATION; ANALYSIS METHOD; CURRENT FLOWING; ELECTRICAL ANALYSIS; ELECTRICAL RESISTIVITY; ELECTRICAL-THERMAL CO-ANLYSIS; IR DROP; JOULE HEATING EFFECT; POWER DELIVERY NETWORK; SIMULATION RESULT; TEMPERATURE DEPENDENT; TEMPERATURE EFFECTS; THERMAL ANALYSIS; THROUGH SILICON VIAS; TOOLSUITE; UNDERFILL MATERIALS;

ELECTRIC CONDUCTIVITY; ELECTRIC POWER TRANSMISSION; ELECTRONICS PACKAGING; HEATING; INTEGRATION; JOULE HEATING; POWER ELECTRONICS; TEMPERATURE; THERMAL EFFECTS; THERMOANALYSIS; THREE DIMENSIONAL;

ELECTRIC NETWORK ANALYSIS;

EID: 70549098155     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/3DIC.2009.5306525     Document Type: Conference Paper

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