In situ X-ray diffraction study of self-forming barriers from a Cu-Mn alloy in 100 nm Cu/low-k damascene interconnects using synchrotron radiation

Microelectronic Engineering

Volumn 87, Issue 3, 2010, Pages 398-401

  Wilson, Christopher J ^a,b   Volders, Henny ^b   Croes, Kristof ^b   Pantouvaki, Marianna ^b   Beyer, Gerald P ^b   Horsfall, Alton B ^a   O'Neill, Anthony G ^a   Tokei, Zsolt ^b  

^a NEWCASTLE UNIVERSITY   (United Kingdom)

^b IMEC   (Belgium)

Author keywords

Damascene; In situ; Low k; Manganese; Oxidation; Self forming barrier; Stress; Synchrotron; Texture; X ray diffraction

Indexed keywords

ANNEAL TEMPERATURES; BARRIER FORMATION; BARRIER SYSTEMS; CU LINES; DAMASCENE; DAMASCENE INTERCONNECTS; DAMASCENE LINES; DIFFRACTION PEAKS; ENHANCED DIFFUSION; FORMATION PROCESS; IN SITU; IN-PLANE; IN-SITU STUDY; ION EXCITATION; LOW-K; METAL OXIDATION; MN CONCENTRATIONS; PEAK SHIFT; SELF-FORMING BARRIER;

COPPER ALLOYS; DIFFRACTION; MANGANESE; MANGANESE COMPOUNDS; OXIDATION; SYNCHROTRON RADIATION; SYNCHROTRONS; TEXTURES; X RAY DIFFRACTION;

X RAY DIFFRACTION ANALYSIS;

EID: 74449087615     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2009.06.023     Document Type: Article

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