Compact and passive-alignment 4-channel x 2.5Gbps optical interconnect modules based on silicon optical benches with 45° micro-reflectors

Optics Express

Volumn 17, Issue 26, 2009, Pages 24250-24260

  Hsiao, Hsu Liang ^a   Lan, Hsiao Chin ^a   Chang, Chia Chi ^a   Lee, Chia Yu ^a   Chen, Siou Ping ^a   Hsu, Chih Hung ^a   Chang, Shuo Fu ^a   Lin, Yo Shen ^a   Kuo, Feng Ming ^a   Shi, Jin Wei ^a   Wu, Mount Learn ^a  

^a NATIONAL CENTRAL UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ALIGNMENT; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONICS PACKAGING; INTEGRATED OPTICS; LASERS; OPTICAL INTERCONNECTS; REFLECTION;

2.5GBPS; ANISOTROPIC WET ETCHING; BONDING PADS; COUPLING EFFICIENCY; EUTECTIC SOLDERS; FLIP CHIP; HIGH FREQUENCY HF; MICRO-REFLECTORS; OPTICAL INTERCONNECT; OPTICAL PATH; SILICON OPTICAL BENCH; SILICON-BASED; TRANSMITTING PARTS; V-GROOVE ARRAYS; VERTICAL-CAVITY SURFACE EMITTING LASER;

SURFACE EMITTING LASERS;

SILICON;

ARTICLE; CHEMISTRY; COMPUTER AIDED DESIGN; ELECTRONICS; EQUIPMENT; EQUIPMENT DESIGN; INSTRUMENTATION; LASER; MICROWAVE RADIATION; OPTICAL INSTRUMENTATION; PHOTOMETRY; REFRACTOMETRY; SYSTEM ANALYSIS; TELECOMMUNICATION;

COMPUTER-AIDED DESIGN; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; LASERS; LENSES; MICROWAVES; MINIATURIZATION; PHOTOMETRY; REFRACTOMETRY; SILICON; SYSTEMS INTEGRATION; TELECOMMUNICATIONS;

EID: 73949109209     PISSN: None     EISSN: 10944087     Source Type: Journal    
DOI: 10.1364/OE.17.024250     Document Type: Article

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