HB-based CAD-oriented dynamic stability analysis of circuits and devices: Application to the assessment of thermal instabilities in multifinger HBTs

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2009, Pages 1493-1496

  Traversa, F L ^a,b   Cappelluti, F ^a   Bonani, F ^a   Ghione, G ^a  

^a POLITECNICO DI TORINO   (Italy)

^b UNIVERSITAT AUTÒNOMA DE BARCELONA   (Spain)

Author keywords

Electrothermal effects; Heterojunction bipolar transistors; Stability

Indexed keywords

CAD TOOL; CALCULATION METHODS; DEVICE OPTIMIZATION; DYNAMIC STABILITY ANALYSIS; ELECTROTHERMAL EFFECTS; FLOQUET MULTIPLIER; FREQUENCY DOMAINS; HARMONIC BALANCE; JACOBIANS; LIMIT CYCLE; MULTIFINGERS; OPTIMIZATION TOOLS; PERIODIC DYNAMICS; STABILITY ANALYSIS; STABILITY ASSESSMENT; STABILIZATION TECHNIQUES; THERMAL INSTABILITIES; THERMAL SHUNT; WORKING POINT;

BIPOLAR TRANSISTORS; COMPUTER AIDED DESIGN; DYNAMIC ANALYSIS; HARMONIC ANALYSIS; HETEROJUNCTIONS; INSULATING MATERIALS; MICROWAVES; SYSTEM STABILITY; THERMODYNAMIC STABILITY;

HETEROJUNCTION BIPOLAR TRANSISTORS;

EID: 73049101863     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2009.5165991     Document Type: Conference Paper

References (11)

1. R.H. Winkler, IEEE Trans. Electron Devices, vol. ED-14, pp. 260-263, May 1967.
2. N. Rinaldi, V. D'Alessandro, IEEE Trans. Electron Devices, vol. ED-52, pp. 2022-2033, Sept. 2005.
3. W. Liu, S. Nelson, D.G. Hill, A. Khatibzadeh, IEEE Trans. Electron Devices, vol. ED-40, pp. 1917-1927, Nov. 1993.
4. C.-H. Liao, C.-P. Lee, N.L. Wang, B. Lin, IEEE Trans. Electron Devices, vol. ED-49, pp. 902-908, May 2002.
5. A. Suárez, R. Quéré, Stability analysis of nonlinear microwave circuits, Norwood: Artech House, 2003.
6. F.L. Traversa, F. Bonani, S. Donati Guerrieri, Int. J. Circuit Theory & App., Vol. 36, No. 4, pp. 421-439, June 2008.
7. Ke Lu, C.M. Snowden, IEEE Trans. Electron Devices, Vol. 43, p. 1799, 1996.
8. F. Cappelluti, F.L. Traversa, F. Bonani, "A rigorous assessment of electro-thermal device instabilities via Harmonic Balance modeling", Proc. EuMIC/EuMC, pp. 434-437, Amsterdam, The Netherlands, 2008.
9. F. Cappelluti, F.L. Traversa, F. Bonani, "A novel, rigorous approach to the dynamic, large-signal stability analysis of semiconductor devices and circuits under electro-thermal interaction", to be presented at IEEE IEDM 2008.
10. R.S. Burton, P. Dai, IEEE Trans. Electron Devices, vol. ED-51, pp. 1033-1036, June 2004.
11. D. D'Amore, P. Maffezzoni, Microel. Journal, vol. 31, pp. 753-758, 2000.