Influence of system integration and packaging on its inductive power link for an integrated wireless neural interface

IEEE Transactions on Biomedical Engineering

Volumn 56, Issue 12, 2009, Pages 2927-2936

  Kim, Sohee ^a   Harrison, Reid R ^b   Solzbacher, Florian ^b  

^a Gwangju Institute of Science and Technology (GIST)   (South Korea)

^b University of Utah   (United States)

Author keywords

Coil; Inductive coupling; Integration; Neural interface; Packaging; Quality factor; Resonance frequency; Utah electrode array (UEA)

Indexed keywords

COIL; ELECTRODE ARRAYS; INDUCTIVE COUPLINGS; NEURAL INTERFACES; PACKAGING QUALITY; RESONANCE FREQUENCIES;

CONDUCTIVE MATERIALS; ELECTRIC PROPERTIES; NATURAL FREQUENCIES; Q FACTOR MEASUREMENT;

DIELECTRIC MATERIALS;

COPPER; GOLD; PHOSPHATE BUFFERED SALINE; SILICON;

ARTICLE; CONDUCTANCE; ELECTRIC CONDUCTIVITY; ELECTRODE; ELECTRONICS; ENCAPSULATION; FILM; IMPEDANCE; IMPLANT; IMPLANTATION; INTEGRATED CIRCUIT; INTEGRATION; MATERIAL COATING; PACKAGING; POWER SUPPLY; SIMULATION;

ACTION POTENTIALS; COMPUTER-AIDED DESIGN; ELECTRIC POWER SUPPLIES; ELECTRODES, IMPLANTED; EQUIPMENT DESIGN; EQUIPMENT FAILURE ANALYSIS; HUMANS; MONITORING, AMBULATORY; PERIPHERAL NERVES; REPRODUCIBILITY OF RESULTS; SENSITIVITY AND SPECIFICITY; SYSTEMS INTEGRATION; TELEMETRY;

EID: 72649086850     PISSN: 00189294     EISSN: None     Source Type: Journal    
DOI: 10.1109/TBME.2009.2028614     Document Type: Article

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