Influence of superimposed ultrasound on deformability of Cu

Journal of Applied Physics

Volumn 106, Issue 11, 2009, Pages

  Huang, H ^a,b   Pequegnat, A ^b   Chang, B H ^a   Mayer, M ^b   Du, D ^a   Zhou, Y ^b  

^a TSINGHUA UNIVERSITY   (China)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

DEFORMABILITY; DISLOCATION THEORY; DYNAMIC ANNEALING; FREE AIR BALLS; MICROHARDNESS TESTING; POLYCRYSTALLINE; RESIDUAL EFFECTS; SOFTENING EFFECT; TWO-MATERIALS; ULTRASONIC IRRADIATION; ULTRASONIC VIBRATION; WIRE BONDING;

ACOUSTIC WAVES; MICROHARDNESS; ULTRASONICS; WIRE;

DEFORMATION;

EID: 72449203199     PISSN: 00218979     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.3266170     Document Type: Article

References (19)

1. G. G. Harman, Wire Bonding in Microelectronics-Materials, Processes, Reliability, and Yield, 2nd ed. (McGraw Hill, New York, 1997).
2. A. Pequegnat, C. J. Hang, M. Mayer, Y. Zhou, J. T. Moon, and J. Persic, J. Mater. Sci.: Mater. Electron. 0957-4522 20, 1144 (2009). 10.1007/s10854-008- 9841-8
3. B. Langenecker, IEEE Trans. Sonics Ultrason. 0018-9537 SU-13, 1 (1966).
4. V. P. Severdenko, V. V. Klubovich, and A. V. Stepanenko, Ultrasonic Rolling and Drawing of Metals, (Consultants Bureau, New York, 1972).
5. D. R. Culp and H. T. Gencsoy, Proceedings of the Ultrasonics Symposium, 1973 (unpublished), pp. 195-198.
6. I. A. Gindin, G. N. Malik, I. M. Neklyudov, and O. T. Rozumnyi, Russ. Phys. J. 1064-8887 15, 192 (1972).
7. N. A. Tyapunina, V. V. Blagoveshchenskii, G. M. Zinenkova, and Yu. A. Ivashkin, Izv. Vyssh. Uchebn. Zaved. Fiz. 0021-3411 6, 118 (1982) N. A. Tyapunina, V. V. Blagoveshchenskii, G. M. Zinenkova, and Y. A. Ivashkin, [Russ. Phys. J. 25, 569 (1982)].
8. M. M. Susan, P. G. Dumitras, and V. G. Iliescu, Surf. Eng. 0267-0844 43, 65 (2007). 10.3103/S1068375507010115
9. U. GeiΒler, M. Schneider-Ramelow, K. D. Lang, and H. Reichl, J. Electron. Mater. 0361-5235 35, 173 (2006). 10.1007/s11664-006-0201-2
10. J. E. Krzanowski, IEEE Trans. Compon., Hybrids, Manuf. Technol. 0148-6411 13, 176 (1990). 10.1109/33.52867 (Pubitemid 20737449)
11. I. Lum, H. Huang, B. H. Chang, M. Mayer, D. Du, and Y. Norman Zhou, J. Appl. Phys. 0021-8979 105, 024905 (2009). 10.1063/1.3068352
12. C. J. Hang, I. Lum, J. Lee, M. Mayer, C. Q. Wang, Y. Zhou, S. J. Hong, and S. M. Lee, Microelectron. Eng. 0167-9317 85, 1795 (2008). 10.1016/j.mee.2008.05.008
13. I. Lum, C. J. Hang, M. Mayer, and Y. Zhou, J. Electron. Mater. 0361-5235 38, 647 (2009). 10.1007/s11664-009-0732-4
14. H. Chunjing, W. Chunqing, and S. Mingda, Proceedings of the 2005 Sixth International Conference on Electronic Packaging Technology, 2005 (unpublished).
15. J. H. Westbrook and H. Conrad, The Science of Hardness Testing and Its Research Applications (American Society for Metals, Ohio, 1973).
16. N. Murdeshwar and J. E. Krzanowski, Metall. Mater. Trans. A 1073-5623 28, 2663 (1997). 10.1007/s11661-997-0023-8
17. M. A. Meyers and K. K. Chwala, Mechanical Metallurgy, Principles, and Applications (Prentice-Hall, Englewood Cliffs, 1984), p. 251.
18. N. Srikanth, S. Murali, Y. M. Wong, and C. J. Vath, III, Thin Solid Films 0040-6090 462-463, 339 (2004). 10.1016/j.tsf.2004.05.116
19. J. H. Cho, J. S. Cho, J. T. Moon, J. Lee, Y. H. Cho, Y. W. Kim, A. D. Rollet, and K. H. Oh, Metall. Mater. Trans. A 1073-5623 34, 1113 (2003). 10.1007/s11661-003-0131-z