Recrystallization and grain growth of cold-drawn gold bonding wire

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 34 A, Issue 5, 2003, Pages 1113-1125

  Cho, J H ^a   Cho, J S ^b   Moon, J T ^b   Lee, J ^b   Cho, Y H ^c   Kim, Y W ^a   Rollett, A D ^d   Oh, K H ^a  

^a Seoul National University   (South Korea)

^b MKE Electronics   (South Korea)

^c Korea Institute of Science and Technology   (South Korea)

^d CARNEGIE MELLON UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANNEALING; BONDING; CRYSTAL MICROSTRUCTURE; ELECTRON DIFFRACTION; PLASTIC DEFORMATION; RECRYSTALLIZATION (METALLURGY); WIRE;

COLD DRAWING;

GOLD;

EID: 0038680263     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-003-0131-z     Document Type: Article

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