3D integration technologies for MEMS/IC systems

Proceedings of the IEEE Bipolar/BiCMOS Circuits and Technology Meeting

Volumn , Issue , 2009, Pages 138-141

  Ramm, Peter ^a   Klumpp, Armin ^a   Weber, Josef ^a  

^a Fraunhofer Institute Reliability and Microintegration   (Germany)

Author keywords

3D integration; 3D IC; E CUBES; Heterogeneous systems; ICV SLID; MEMS; More than Moore; Through Silicon Via; TPMS; TSV technology

Indexed keywords

3-D INTEGRATION; E-CUBES; HETEROGENEOUS SYSTEMS; ICV-SLID; THROUGH-SILICON-VIA;

COST EFFECTIVENESS; COSTS; FABRICATION; GEOMETRY; INTEGRATION; MEMS; MICROELECTROMECHANICAL DEVICES; TECHNOLOGY;

THREE DIMENSIONAL;

EID: 72449134874     PISSN: 10889299     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/BIPOL.2009.5314117     Document Type: Conference Paper

References (9)

1. S. Arkalgud, "SEMATECH 3-D TSV Technology Development", Proc. International 3D System Integration Conference 3D-SIC 2008, Tokyo, Japan
2. International Technology Roadmap for Semiconductors (ITRS) http://www.public.itrs.net 2007 release
3. http://www.ecubes.org
4. P. Garrou and C. Bower, "Overview of 3D Integration Process Technology" in Handbook of 3D Integration, edited by P. Garrou, C. Bower and P. Ramm, Wiley-VCH, 2008 (ISBN: 978-3-527-32034-9), p. 25-44
5. "3D IC, WLP and TSV Packaging Newsletter", I-micronews (Yole Developpement), http://www.imicronews.com 2008 May issue
6. P. Ramm, J. Wolf, B. Wunderle, "Wafer-level 3D System Integration" in Handbook of 3D Integration, edited by P. Garrou, C. Bower and P. Ramm, Wiley-VCH, 2008 (ISBN: 978-3-527-32034-9), p. 289-318
7. P. Ramm, J. Wolf, A. Klumpp, R. Wieland, B. Wunderle, B. Michel, "Through Silicon Via Technology", Proc. 58th ECTC, Lake Buena Vista, FL, 2008
8. M. M. V. Taklo, H. Tofteberg, N. Lietaer, T. Seppänen, P. Ramm, W. Weber, Proc. Design, Test, Integration and Packaging of MEMS/MOEMS-DTIP2009, Rome (2009), p. 74-77
9. P. Ramm, A. Klumpp, J. Weber, M. M. V. Taklo, Proc. Design, Test, Integration and Packaging of MEMS/MOEMS-DTIP2009, Rome (2009), p. 71-73